Issued Patents All Time
Showing 25 most recent of 27 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11062969 | Wafer level chip scale package structure and manufacturing method thereof | Cheow Khoon Oh, Xiaoming Sui, Bo Chen, Vincent Xue | 2021-07-13 |
| 10504823 | Power semiconductor device with small contact footprint and the preparation method | Hongtao Gao, Jun Lu, Jianxin Ye, Yan Huo, Hua Pan | 2019-12-10 |
| 10242926 | Wafer level chip scale package structure and manufacturing method thereof | Cheow Khoon Oh, Xiaoming Sui, Bo Chen, Vincent Xue | 2019-03-26 |
| 10043736 | Hybrid packaged lead frame based multi-chip semiconductor device with multiple interconnecting structures | Hamza Yilmaz, Yan Xun Xue, Jun Lu, Peter H. Wilson, Yan Huo +1 more | 2018-08-07 |
| 9854686 | Preparation method of a thin power device | Yuping Gong, Yan Xun Xue, Ping Huang, Jun Lu, Hamza Yilmaz | 2017-12-26 |
| 9685430 | Embedded package and method thereof | Zhiqiang Niu, Hua Pan, Yueh-Se Ho, Jun Lu | 2017-06-20 |
| 9679833 | Semiconductor package with small gate clip and assembly method | Yan Xun Xue, Hamza Yilmaz, Yueh-Se Ho, Jun Lu, Hongtao Gao | 2017-06-13 |
| 9653383 | Semiconductor device with thick bottom metal and preparation method thereof | Hamza Yilmaz, Yan Xun Xue, Jun Lu, Yan Huo, Aihua Lu | 2017-05-16 |
| 9646920 | Power semiconductor device with small contact footprint and the preparation method | Hongtao Gao, Jun Lu, Jianxin Ye, Yan Huo, Hua Pan | 2017-05-09 |
| 9472491 | Semiconductor package with small gate clip and assembly method | Yan Xun Xue, Hamza Yilmaz, Yueh-Se Ho, Jun Lu, Hongtao Gao | 2016-10-18 |
| 9437587 | Flip chip semiconductor device | Xiaotian Zhang, Hamza Yilmaz, Jun Lu, Xiaoguang Zeng | 2016-09-06 |
| 9425181 | Method of hybrid packaging a lead frame based multi-chip semiconductor device with multiple interconnecting structures | Hamza Yilmaz, Yan Xun Xue, Jun Lu, Peter H. Wilson, Yan Huo +1 more | 2016-08-23 |
| 9337131 | Power semiconductor device and the preparation method | Yan Huo, Hamza Yilmaz, Jun Lu, Zhi Qiang Niu, Yan Xun Xue +1 more | 2016-05-10 |
| 9318396 | Method of fabricating flash memory | Chia-Ming Wu | 2016-04-19 |
| 9269699 | Embedded package and method thereof | Zhiqiang Niu, Hua Pan, Yueh-Se Ho, Jun Lu | 2016-02-23 |
| 9245831 | Top-exposed semiconductor package and the manufacturing method | Yan Huo, Zhi Qiang Niu, Hongtao Gao | 2016-01-26 |
| 9230949 | Method of making stacked multi-chip packaging structure | Xiaotian Zhang, Hua Pan, Jun Lu, Hamza Yilmaz | 2016-01-05 |
| 9171788 | Semiconductor package with small gate clip and assembly method | Yan Xun Xue, Hamza Yilmaz, Yueh-Se Ho, Jun Lu, Hongtao Gao | 2015-10-27 |
| 9087828 | Semiconductor device with thick bottom metal and preparation method thereof | Hamza Yilmaz, Yan Xun Xue, Jun Lu, Yan Huo, Aihua Lu | 2015-07-21 |
| 9054091 | Hybrid packaged lead frame based multi-chip semiconductor device with multiple semiconductor chips and multiple interconnecting structures | Hamza Yilmaz, Yan Xun Xue, Jun Lu, Peter H. Wilson, Yan Huo +1 more | 2015-06-09 |
| 9006870 | Stacked multi-chip packaging structure and manufacturing method thereof | Xiaotian Zhang, Hua Pan, Jun Lu, Hamza Yilmaz | 2015-04-14 |
| 9006901 | Thin power device and preparation method thereof | Yuping Gong, Yan Xun Xue, Ping Huang, Jun Lu, Hamza Yilmaz | 2015-04-14 |
| 8952509 | Stacked multi-chip bottom source semiconductor device and preparation method thereof | Hamza Yilmaz, Yueh-Se Ho, Yan Xun Xue, Jun Lu, Xiaotian Zhang +4 more | 2015-02-10 |
| 8703545 | Aluminum alloy lead-frame and its use in fabrication of power semiconductor package | Zhiqiang Niu, Yan Xun Xue, Yan Huo, Hua Pan, Guo Feng Lian +1 more | 2014-04-22 |
| 8669650 | Flip chip semiconductor device | Xiaotian Zhang, Hamza Yilmaz, Jun Lu, Xiaoguang Zeng | 2014-03-11 |