Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11062969 | Wafer level chip scale package structure and manufacturing method thereof | Cheow Khoon Oh, Ming-Chen Lu, Bo Chen, Vincent Xue | 2021-07-13 |
| 10242926 | Wafer level chip scale package structure and manufacturing method thereof | Cheow Khoon Oh, Ming-Chen Lu, Bo Chen, Vincent Xue | 2019-03-26 |
| 9437528 | Dual-side exposed semiconductor package with ultra-thin die and manufacturing method thereof | Yuping Gong, Yan Yun Xue, Jun Lu | 2016-09-06 |