Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11062969 | Wafer level chip scale package structure and manufacturing method thereof | Ming-Chen Lu, Xiaoming Sui, Bo Chen, Vincent Xue | 2021-07-13 |
| 10242926 | Wafer level chip scale package structure and manufacturing method thereof | Ming-Chen Lu, Xiaoming Sui, Bo Chen, Vincent Xue | 2019-03-26 |
| 9881856 | Molded intelligent power module | Bum Seok Suh, Zhiqiang Niu, Wonjin Cho, Son Tran, James Rachana Bou | 2018-01-30 |
| 9837386 | Power device and preparation method thereof | Xiaotian Zhang, Shekar Mallikarjunaswamy, Zhiqiang Niu, Yueh-Se Ho | 2017-12-05 |
| 9704789 | Molded intelligent power module | Bum Seok Suh, Zhiqiang Niu, Wonjin Cho, Son Tran, James Rachana Bou | 2017-07-11 |