Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11062969 | Wafer level chip scale package structure and manufacturing method thereof | Cheow Khoon Oh, Ming-Chen Lu, Xiaoming Sui, Bo Chen | 2021-07-13 |
| 10242926 | Wafer level chip scale package structure and manufacturing method thereof | Cheow Khoon Oh, Ming-Chen Lu, Xiaoming Sui, Bo Chen | 2019-03-26 |