Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11309233 | Power semiconductor package having integrated inductor, resistor and capacitor | Xiaotian Zhang, Mary Jane R. Alin, David Brian Oraboni, JR., Long Wang, Jian Yin | 2022-04-19 |
| 11062969 | Wafer level chip scale package structure and manufacturing method thereof | Cheow Khoon Oh, Ming-Chen Lu, Xiaoming Sui, Vincent Xue | 2021-07-13 |
| 10991660 | Semiconductor package having high mechanical strength | Long Wang, Zhen Du, Jun Lu, Yueh-Se Ho | 2021-04-27 |
| 10840219 | Semiconductor package structure and method for manufacturing the same | Tang-Yuan Chen, Yu-Chang Chen, Jin-Feng Yang, Chin-Li KAO, Meng-Kai SHIH | 2020-11-17 |
| 10332862 | Semiconductor package structure and method for manufacturing the same | Tang-Yuan Chen, Yu-Chang Chen, Jin-Feng Yang, Chin-Li KAO, Meng-Kai SHIH | 2019-06-25 |
| 10242926 | Wafer level chip scale package structure and manufacturing method thereof | Cheow Khoon Oh, Ming-Chen Lu, Xiaoming Sui, Vincent Xue | 2019-03-26 |