Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12166009 | Semiconductor device packages and methods of manufacturing the same | Tang-Yuan Chen, Teck-Chong Lee, Shin-Luh TARNG, Chih-Pin Hung | 2024-12-10 |
| 11742324 | Semiconductor device packages and methods of manufacturing the same | Tang-Yuan Chen, Teck-Chong Lee, Shin-Luh TARNG, Chih-Pin Hung | 2023-08-29 |
| 11375124 | Optical measurement equipment and method for measuring warpage of a workpiece | Ming-Han Wang, Ian HU, Hsuan-Yu Chen | 2022-06-28 |
| 11217502 | Semiconductor device packages and methods of manufacturing the same | Ian HU, Chih-Pin Hung | 2022-01-04 |
| 11164756 | Semiconductor device package having continously formed tapered protrusions | Ying-Xu Lu, Tang-Yuan Chen, Jin-Yuan Lai, Tse-Chuan Chou, Shin-Luh TARNG | 2021-11-02 |
| 11011496 | Semiconductor device packages and methods of manufacturing the same | Tang-Yuan Chen, Teck-Chong Lee, Shin-Luh TARNG, Chih-Pin Hung | 2021-05-18 |
| 10985085 | Semiconductor device package and method for manufacturing the same | Ian HU, Chih-Pin Hung | 2021-04-20 |
| 10861726 | Apparatus and method for measuring warpage | Chun Hung TSAI, Hsuan-Yu Chen, Ian HU, Shin-Luh TARNG | 2020-12-08 |
| 10840219 | Semiconductor package structure and method for manufacturing the same | Bo Chen, Tang-Yuan Chen, Yu-Chang Chen, Jin-Feng Yang, Chin-Li KAO | 2020-11-17 |
| 10770369 | Semiconductor device package | Chih-Pin Hung, Tang-Yuan Chen, Jin-Feng Yang | 2020-09-08 |
| 10586716 | Semiconductor device package | Ying-Xu Lu, Tang-Yuan Chen, Jin-Yuan Lai, Tse-Chuan Chou, Shin-Luh TARNG | 2020-03-10 |
| 10332862 | Semiconductor package structure and method for manufacturing the same | Bo Chen, Tang-Yuan Chen, Yu-Chang Chen, Jin-Feng Yang, Chin-Li KAO | 2019-06-25 |
| 8698307 | Semiconductor package with integrated metal pillars and manufacturing methods thereof | Chang-Chi Lee | 2014-04-15 |