Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12300560 | Semiconductor device package and method of manufacturing the same | Ian HU | 2025-05-13 |
| 11901252 | Semiconductor device package and method of manufacturing the same | Ian HU | 2024-02-13 |
| 11869828 | Semiconductor package through hole with lever arms and insulating layers with different coefficient of thermal expansion | Yi-Chi Chen | 2024-01-09 |
| 11598625 | Apparatus and method for deformation measurement | Hsuan-Yu Chen | 2023-03-07 |
| 11410902 | Semiconductor device package and method of manufacturing the same | Ian HU | 2022-08-09 |
| 11375124 | Optical measurement equipment and method for measuring warpage of a workpiece | Ian HU, Meng-Kai SHIH, Hsuan-Yu Chen | 2022-06-28 |
| 11152274 | Multi-moldings fan-out package and process | Wei-Hsuan Lee, Sung-Mao Li, Ian HU | 2021-10-19 |
| 10522508 | Semiconductor device package and a method of manufacturing the same | Ian HU, Tsun-Lung Hsieh, Chih-Yi Huang, Chih-Pin Hung | 2019-12-31 |