Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11152274 | Multi-moldings fan-out package and process | Wei-Hsuan Lee, Ming-Han Wang, Ian HU | 2021-10-19 |
| 10157855 | Semiconductor device including electric and magnetic field shielding | Wei-Hsuan Lee, Chien Liu, Jaw-Ming Ding | 2018-12-18 |
| 9653415 | Semiconductor device packages and method of making the same | Wei-Hsuan Lee, Chien Liu | 2017-05-16 |
| 9397074 | Semiconductor device package and method of manufacturing the same | Wei-Hsuan Lee, Chien Liu | 2016-07-19 |
| 8847686 | Electronic system, RF power amplifier and temperature compensation method thereof | Jaw-Ming Ding, Wei-Hsuan Lee | 2014-09-30 |