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Semiconductor device including electric and magnetic field shielding |
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2018-12-18 |
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Semiconductor device packages and method of making the same |
Wei-Hsuan Lee, Sung-Mao Li |
2017-05-16 |
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Wei-Hsuan Lee, Sung-Mao Li |
2016-07-19 |
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Low noise amplifier and receiver |
Jaw-Ming Ding |
2015-10-20 |
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Electronic system—radio frequency power amplifier and method for dynamic adjusting bias point |
Jaw-Ming Ding |
2015-09-29 |
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Tunable radio frequency coupler and manufacturing method thereof |
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2015-05-05 |
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Package structure with conformal shielding and inspection method using the same |
Jaw-Ming Ding, Chih-Hao Chiang |
2014-07-01 |
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Circuit carrier and semiconductor package using the same |
Chih-Ming Chung |
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Semiconductor package and method for manufacturing the same |
Chia Chien Hu, Chao Liu, Chih-Ming Chung |
2011-03-08 |
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Stacked type chip package structure including a chip package and a chip that are stacked on a lead frame |
Yao-Kai Chuang, Chih-Ming Chung, Chao Liu |
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— |
2010-10-19 |
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Meng-Jen Wang, Tsan-Sheng Huang |
2008-09-16 |
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Flip chip package with anti-floating structure |
Meng-Jen Wang, Sheng-Tai Tsai |
2008-05-06 |
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Semiconductor package with a flip chip on a solder-resist leadframe |
Hsueh-Te Wang, Meng-Jen Wang, Chi-Hao Chiu, Tai-Yuan Huang |
2007-08-07 |
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Hsueh-Te Wang, Meng-Jen Wang, Chi-Hao Chiu |
2007-01-16 |
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Flip-chip type quad flat package and leadframe |
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2006-06-27 |
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