Issued Patents All Time
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10157855 | Semiconductor device including electric and magnetic field shielding | Wei-Hsuan Lee, Sung-Mao Li, Jaw-Ming Ding | 2018-12-18 |
| 9653415 | Semiconductor device packages and method of making the same | Wei-Hsuan Lee, Sung-Mao Li | 2017-05-16 |
| 9397074 | Semiconductor device package and method of manufacturing the same | Wei-Hsuan Lee, Sung-Mao Li | 2016-07-19 |
| 9166530 | Low noise amplifier and receiver | Jaw-Ming Ding | 2015-10-20 |
| 9148097 | Electronic system—radio frequency power amplifier and method for dynamic adjusting bias point | Jaw-Ming Ding | 2015-09-29 |
| 9123981 | Tunable radio frequency coupler and manufacturing method thereof | Wei-Hsuan Lee, Jaw-Ming Ding, Huang-Hua Wen | 2015-09-01 |
| 9024689 | Electronic system—radio frequency power amplifier and method for self-adjusting bias point | Jaw-Ming Ding | 2015-05-05 |
| 8766654 | Package structure with conformal shielding and inspection method using the same | Jaw-Ming Ding, Chih-Hao Chiang | 2014-07-01 |
| 8384204 | Circuit carrier and semiconductor package using the same | Chih-Ming Chung | 2013-02-26 |
| 7902650 | Semiconductor package and method for manufacturing the same | Chia Chien Hu, Chao Liu, Chih-Ming Chung | 2011-03-08 |
| 7834469 | Stacked type chip package structure including a chip package and a chip that are stacked on a lead frame | Yao-Kai Chuang, Chih-Ming Chung, Chao Liu | 2010-11-16 |
| 7816773 | Package structure and manufacturing method thereof | — | 2010-10-19 |
| 7425468 | Method for making flip chip on leadframe package | Meng-Jen Wang, Tsan-Sheng Huang | 2008-09-16 |
| 7368806 | Flip chip package with anti-floating structure | Meng-Jen Wang, Sheng-Tai Tsai | 2008-05-06 |
| 7253508 | Semiconductor package with a flip chip on a solder-resist leadframe | Hsueh-Te Wang, Meng-Jen Wang, Chi-Hao Chiu, Tai-Yuan Huang | 2007-08-07 |
| 7164202 | Quad flat flip chip package and leadframe thereof | Hsueh-Te Wang, Meng-Jen Wang, Chi-Hao Chiu | 2007-01-16 |
| 7067904 | Flip-chip type quad flat package and leadframe | Hsueh-Te Wang, Meng-Jen Wang, Chi-Hao Chiu | 2006-06-27 |
| 7022551 | Quad flat flip chip packaging process and leadframe therefor | Hsueh-Te Wang, Meng-Jen Wang, Chi-Hao Chiu | 2006-04-04 |
| 6967403 | Package structure with a heat spreader and manufacturing method thereof | Chi-Ta Chuang, Chih-Min Pao, Chi-Hao Chiu | 2005-11-22 |