Chien Liu — 19 Patents at Advanced Semiconductor Engineering

Chien Liu has been granted 19 US patents while listed as an inventor at Advanced Semiconductor Engineering. The first was granted in 2005 and the most recent in December 2018. Chien Liu ranks #229,345 of 4,157,543 US inventors in our database (top 5.5%). Patent records list Chien Liu in Kaohsiung, TW.

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Showing 1–19 of 19 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
10157855	Semiconductor device including electric and magnetic field shielding	Wei-Hsuan Lee, Sung-Mao Li, Jaw-Ming Ding	2018-12-18	$1,395,000
9653415	Semiconductor device packages and method of making the same	Wei-Hsuan Lee, Sung-Mao Li	2017-05-16	$1,763,000
9397074	Semiconductor device package and method of manufacturing the same	Wei-Hsuan Lee, Sung-Mao Li	2016-07-19	$7,105,000
9166530	Low noise amplifier and receiver	Jaw-Ming Ding	2015-10-20	$2,964,000
9148097	Electronic system—radio frequency power amplifier and method for dynamic adjusting bias point	Jaw-Ming Ding	2015-09-29	$2,708,000
9123981	Tunable radio frequency coupler and manufacturing method thereof	Wei-Hsuan Lee, Jaw-Ming Ding, Huang-Hua Wen	2015-09-01	$4,705,000
9024689	Electronic system—radio frequency power amplifier and method for self-adjusting bias point	Jaw-Ming Ding	2015-05-05	$2,982,000
8766654	Package structure with conformal shielding and inspection method using the same	Jaw-Ming Ding, Chih-Hao Chiang	2014-07-01
8384204	Circuit carrier and semiconductor package using the same	Chih-Ming Chung	2013-02-26	$2,747,000
7902650	Semiconductor package and method for manufacturing the same	Chia Chien Hu, Chao Liu, Chih-Ming Chung	2011-03-08	$1,736,000
7834469	Stacked type chip package structure including a chip package and a chip that are stacked on a lead frame	Yao-Kai Chuang, Chih-Ming Chung, Chao Liu	2010-11-16	$540,000
7816773	Package structure and manufacturing method thereof	—	2010-10-19	$364,000
7425468	Method for making flip chip on leadframe package	Meng-Jen Wang, Tsan-Sheng Huang	2008-09-16	$498,000
7368806	Flip chip package with anti-floating structure	Meng-Jen Wang, Sheng-Tai Tsai	2008-05-06	$1,945,000
7253508	Semiconductor package with a flip chip on a solder-resist leadframe	Hsueh-Te Wang, Meng-Jen Wang, Chi-Hao Chiu, Tai-Yuan Huang	2007-08-07	$302,000
7164202	Quad flat flip chip package and leadframe thereof	Hsueh-Te Wang, Meng-Jen Wang, Chi-Hao Chiu	2007-01-16	$558,000
7067904	Flip-chip type quad flat package and leadframe	Hsueh-Te Wang, Meng-Jen Wang, Chi-Hao Chiu	2006-06-27	$1,030,000
7022551	Quad flat flip chip packaging process and leadframe therefor	Hsueh-Te Wang, Meng-Jen Wang, Chi-Hao Chiu	2006-04-04	$351,000
6967403	Package structure with a heat spreader and manufacturing method thereof	Chi-Ta Chuang, Chih-Min Pao, Chi-Hao Chiu	2005-11-22	$218,000

Chien Liu — 19 Patents

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