Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6967403 | Package structure with a heat spreader and manufacturing method thereof | Chi-Ta Chuang, Chien Liu, Chi-Hao Chiu | 2005-11-22 |
| 6691876 | Semiconductor wafer cassette | Yu-Pin Tsai, Ching-Feng Tseng, Fu Tang Chu | 2004-02-17 |
| 6503776 | Method for fabricating stacked chip package | Tsung-Ming Pai, Kuang-Hui Chen | 2003-01-07 |