Issued Patents All Time
Showing 1–24 of 24 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9824827 | Method for making solid electrolytic capacitor package structure with improved conductive terminals | Ming-Tsung Chen, Kun-Huang Chang | 2017-11-21 |
| 9754729 | Solid-state electrolytic capacitor with improved metallic anode and method for manufacturing the same | Ming-Tsung Chen, CHAI-CHING SUNG | 2017-09-05 |
| 9741496 | Stacked-type solid electrolytic capacitor package structure and method of manufacturing the same | Kun-Huang Chang, Szu Chieh Huang | 2017-08-22 |
| 9159490 | Solid electrolytic capacitor package structure and method of manufacturing the same, and conductive unit | Ming-Tsung Chen, Kun-Huang Chang | 2015-10-13 |
| 9105398 | Method of manufacturing a stacked-type solid electrolytic capacitor package structure having a plurality of negative lead pins | Kun-Huang Chang | 2015-08-11 |
| 8787002 | Winding-type solid electrolytic capacitor package structure | Ching-Feng Lin, Kun-Huang Chang | 2014-07-22 |
| 8755171 | Stacked-type solid electrolytic capacitor package structure | Ching-Feng Lin, Kun-Huang Chang | 2014-06-17 |
| 8654511 | Capacitance unit and stacked solid electrolytic capacitor | Ching-Feng Lin, Kun-Huang Chang | 2014-02-18 |
| 8390991 | Stacked solid-state electrolytic capacitor with multi-directional product lead frame structure | Yui-Shin Fran, Ching-Feng Lin, Chun-Chia Huang, Chun-Hung Lin, Wen-Yen Huang | 2013-03-05 |
| 8373972 | Solid electrolytic capacitor having a protective structure and method for manufacturing the same | Ching-Feng Lin, Wen-Yen Huang, Chun-Chia Huang | 2013-02-12 |
| 8369066 | Lamellar stacked solid electrolytic capacitor | Ching-Feng Lin, Yui-Hsin Fran, Ming-Tsung Chen, Cheng-Wei Lai, Chun-Chia Huang | 2013-02-05 |
| 8310814 | Stacked capacitor with positive multi-pin structure | Yui-Hsin Fran, Ching-Feng Lin, Chun-Chia Huang | 2012-11-13 |
| 8305734 | Insulating encapsulation structure for solid chip electrolytic capacitor | Ming-Tsung Chen, Chiao-Yinms Yang | 2012-11-06 |
| 8305735 | Stacked solid electrolytic capacitor with multi-pin structure | Yui-Shin Fran, Ching-Feng Lin, Chun-Chia Huang, Wen-Yen Huang | 2012-11-06 |
| 8164883 | Stacked solid electrolytic capacitor and a method for manufacturing the same | Ching-Feng Lin, Chun-Chia Huang, Chien-Ting Liu | 2012-04-24 |
| 7404663 | Backlight module | Ping-Fu Wang | 2008-07-29 |
| 7253508 | Semiconductor package with a flip chip on a solder-resist leadframe | Chien Liu, Hsueh-Te Wang, Meng-Jen Wang, Tai-Yuan Huang | 2007-08-07 |
| 7164202 | Quad flat flip chip package and leadframe thereof | Hsueh-Te Wang, Meng-Jen Wang, Chien Liu | 2007-01-16 |
| 7163840 | Flip chip package and manufacturing method thereof | Yu-Wen Chen, Chih-Ming Chung | 2007-01-16 |
| 7138900 | Resetable over-current protection device and method of making the same | Wen-Lung Liu, Kang-Neng Hsu, Szu-Lung Sun | 2006-11-21 |
| 7067904 | Flip-chip type quad flat package and leadframe | Hsueh-Te Wang, Meng-Jen Wang, Chien Liu | 2006-06-27 |
| 7022551 | Quad flat flip chip packaging process and leadframe therefor | Hsueh-Te Wang, Meng-Jen Wang, Chien Liu | 2006-04-04 |
| 6967403 | Package structure with a heat spreader and manufacturing method thereof | Chi-Ta Chuang, Chih-Min Pao, Chien Liu | 2005-11-22 |
| 6929980 | Manufacturing method of flip chip package | Yu-Wen Chen, Chi-Ta Chuang, Chi-Sheng Chao | 2005-08-16 |