Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10978406 | Semiconductor package including EMI shielding structure and method for forming the same | Hung-Jen Chang, Jen-Chuan Chen, Wen-Sung Hsu | 2021-04-13 |
| 10685943 | Semiconductor chip package with resilient conductive paste post and fabrication method thereof | Shiann-Tsong Tsai | 2020-06-16 |
| 10037936 | Semiconductor package with coated bonding wires and fabrication method thereof | Shiann-Tsong Tsai, Chin-Chiang Chang | 2018-07-31 |
| 7253508 | Semiconductor package with a flip chip on a solder-resist leadframe | Chien Liu, Meng-Jen Wang, Chi-Hao Chiu, Tai-Yuan Huang | 2007-08-07 |
| 7164202 | Quad flat flip chip package and leadframe thereof | Meng-Jen Wang, Chien Liu, Chi-Hao Chiu | 2007-01-16 |
| 7067904 | Flip-chip type quad flat package and leadframe | Meng-Jen Wang, Chi-Hao Chiu, Chien Liu | 2006-06-27 |
| 7034388 | Stack type flip-chip package | Chaur-Chin Yang | 2006-04-25 |
| 7022551 | Quad flat flip chip packaging process and leadframe therefor | Meng-Jen Wang, Chien Liu, Chi-Hao Chiu | 2006-04-04 |
| 6768190 | Stack type flip-chip package | Chaur-Chin Yang | 2004-07-27 |
| 6258626 | Method of making stacked chip package | Su Tao | 2001-07-10 |
| 6153939 | Flip-chip semiconductor device with enhanced reliability and manufacturing efficiency, and the method for under filling the same | Wei-Chung Wang, Jen-Kuang Fang, Su Tao | 2000-11-28 |