Hsueh-Te Wang — 11 Patents at Advanced Semiconductor Engineering

Hsueh-Te Wang has been granted 11 US patents while listed as an inventor at Advanced Semiconductor Engineering. The first was granted in 2000 and the most recent in April 2021. Hsueh-Te Wang ranks #435,149 of 4,157,543 US inventors in our database (top 10.5%). Patent records list Hsueh-Te Wang in Hsinchu, TW.

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Showing 1–11 of 11 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
10978406	Semiconductor package including EMI shielding structure and method for forming the same	Hung-Jen Chang, Jen-Chuan Chen, Wen-Sung Hsu	2021-04-13
10685943	Semiconductor chip package with resilient conductive paste post and fabrication method thereof	Shiann-Tsong Tsai	2020-06-16
10037936	Semiconductor package with coated bonding wires and fabrication method thereof	Shiann-Tsong Tsai, Chin-Chiang Chang	2018-07-31
7253508	Semiconductor package with a flip chip on a solder-resist leadframe	Chien Liu, Meng-Jen Wang, Chi-Hao Chiu, Tai-Yuan Huang	2007-08-07	$302,000
7164202	Quad flat flip chip package and leadframe thereof	Meng-Jen Wang, Chien Liu, Chi-Hao Chiu	2007-01-16	$558,000
7067904	Flip-chip type quad flat package and leadframe	Meng-Jen Wang, Chi-Hao Chiu, Chien Liu	2006-06-27	$1,030,000
7034388	Stack type flip-chip package	Chaur-Chin Yang	2006-04-25	$690,000
7022551	Quad flat flip chip packaging process and leadframe therefor	Meng-Jen Wang, Chien Liu, Chi-Hao Chiu	2006-04-04	$351,000
6768190	Stack type flip-chip package	Chaur-Chin Yang	2004-07-27	$197,000
6258626	Method of making stacked chip package	Su Tao	2001-07-10	$991,000
6153939	Flip-chip semiconductor device with enhanced reliability and manufacturing efficiency, and the method for under filling the same	Wei-Chung Wang, Jen-Kuang Fang, Su Tao	2000-11-28

Hsueh-Te Wang — 11 Patents

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