Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12230562 | Three-dimensional pad structure and interconnection structure for electronic devices | — | 2025-02-18 |
| 11869831 | Semiconductor package with improved board level reliability | Yin Chen, Shih-Chin Lin | 2024-01-09 |
| 11264309 | Multi-row QFN semiconductor package | — | 2022-03-01 |
| 10037936 | Semiconductor package with coated bonding wires and fabrication method thereof | Shiann-Tsong Tsai, Hsueh-Te Wang | 2018-07-31 |
| 9905515 | Integrated circuit stress releasing structure | Tao Cheng | 2018-02-27 |
| 9837595 | Semiconductor package assembly with thermal recycling function | Long Yu, Chia-Wei Chi, Chia-Feng Yeh, Tai-Yu Chen | 2017-12-05 |
| 9319616 | Control method of an audio/video system | Kuang-Cheng Chao, Wei-Wen Mai, Chien-Cheng Lin, Min Chen, Wen Wei | 2016-04-19 |
| 8743293 | Control method of an audio/video system | Kuang-Cheng Chao, Wei-Wen Mai, Chien-Cheng Lin, Min Chen, Wen Wei | 2014-06-03 |