Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7473989 | Flip-chip package | Sung-Fei Wang | 2009-01-06 |
| 7034388 | Stack type flip-chip package | Hsueh-Te Wang | 2006-04-25 |
| 6861761 | Multi-chip stack flip-chip package | Sung-Fei Wang | 2005-03-01 |
| 6768190 | Stack type flip-chip package | Hsueh-Te Wang | 2004-07-27 |
| 6717253 | Assembly package with stacked dies and signal transmission plate | — | 2004-04-06 |