Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7473989 | Flip-chip package | Chaur-Chin Yang | 2009-01-06 |
| 7291924 | Flip chip stacked package | Ming-Lun Ho | 2007-11-06 |
| 7268418 | Multi-chips stacked package | — | 2007-09-11 |
| 7215016 | Multi-chips stacked package | — | 2007-05-08 |
| 7025848 | Heat sink for chip package and bonding method thereof | — | 2006-04-11 |
| 7026719 | Semiconductor package with a heat spreader | — | 2006-04-11 |
| 7023079 | Stacked semiconductor chip package | Tsung-Ming Pai, Kuang-Hui Chen | 2006-04-04 |
| 7015577 | Flip chip package capable of measuring bond line thickness of thermal interface material | — | 2006-03-21 |
| 7002255 | Multi-chips stacked package | — | 2006-02-21 |
| 6949826 | High density semiconductor package | — | 2005-09-27 |
| 6936930 | Thermal enhance MCM package | — | 2005-08-30 |
| 6879031 | Multi-chips package | — | 2005-04-12 |
| 6861761 | Multi-chip stack flip-chip package | Chaur-Chin Yang | 2005-03-01 |
| 6365966 | Stacked chip scale package | Jian Chen | 2002-04-02 |
| 6161753 | Method of making a low-profile wire connection for stacked dies | Yu-Fang Tsai, Su Tao, Meng-Hui Lin | 2000-12-19 |