| 7473989 |
Flip-chip package |
Chaur-Chin Yang |
2009-01-06 |
| 7291924 |
Flip chip stacked package |
Ming-Lun Ho |
2007-11-06 |
| 7268418 |
Multi-chips stacked package |
— |
2007-09-11 |
| 7215016 |
Multi-chips stacked package |
— |
2007-05-08 |
| 7025848 |
Heat sink for chip package and bonding method thereof |
— |
2006-04-11 |
| 7026719 |
Semiconductor package with a heat spreader |
— |
2006-04-11 |
| 7023079 |
Stacked semiconductor chip package |
Tsung-Ming Pai, Kuang-Hui Chen |
2006-04-04 |
| 7015577 |
Flip chip package capable of measuring bond line thickness of thermal interface material |
— |
2006-03-21 |
| 7002255 |
Multi-chips stacked package |
— |
2006-02-21 |
| 6949826 |
High density semiconductor package |
— |
2005-09-27 |
| 6936930 |
Thermal enhance MCM package |
— |
2005-08-30 |
| 6879031 |
Multi-chips package |
— |
2005-04-12 |
| 6861761 |
Multi-chip stack flip-chip package |
Chaur-Chin Yang |
2005-03-01 |
| 6365966 |
Stacked chip scale package |
Jian Chen |
2002-04-02 |
| 6161753 |
Method of making a low-profile wire connection for stacked dies |
Yu-Fang Tsai, Su Tao, Meng-Hui Lin |
2000-12-19 |