Sung-Fei Wang has been granted 15 US patents while listed as an inventor at Advanced Semiconductor Engineering . The first was granted in 2000 and the most recent in January 2009. Sung-Fei Wang ranks #307,048 of 4,157,543 US inventors in our database (top 7.4%).
Patents per Year Patents granted per year, 2000 to 2009 Bar chart with a peak of 5 patents in 2006. peak 5 2000: 1 patents 2000 2002: 1 patents 2002 2005: 4 patents 2005 2006: 5 patents 2006 2007: 3 patents 2007 2009: 1 patents 2009
Issued Patents All Time
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Showing 1–15 of 15 patents
Patent # Title Co-Inventors Date Approx Value ⓘ
7473989 Flip-chip package Chaur-Chin Yang 2009-01-06
$211,000
7291924 Flip chip stacked package Ming-Lun Ho 2007-11-06
$565,000
7268418 Multi-chips stacked package — 2007-09-11
$411,000
7215016 Multi-chips stacked package — 2007-05-08
$478,000
7025848 Heat sink for chip package and bonding method thereof — 2006-04-11
$359,000
7026719 Semiconductor package with a heat spreader — 2006-04-11
$359,000
7023079 Stacked semiconductor chip package Tsung-Ming Pai , Kuang-Hui Chen 2006-04-04
$351,000
7015577 Flip chip package capable of measuring bond line thickness of thermal interface material — 2006-03-21
$182,000
7002255 Multi-chips stacked package — 2006-02-21
$214,000
6949826 High density semiconductor package — 2005-09-27
$874,000
6936930 Thermal enhance MCM package — 2005-08-30
$768,000
6879031 Multi-chips package — 2005-04-12
$183,000
6861761 Multi-chip stack flip-chip package Chaur-Chin Yang 2005-03-01
$202,000
6365966 Stacked chip scale package Jian Chen 2002-04-02
$3,496,000
6161753 Method of making a low-profile wire connection for stacked dies Yu-Fang Tsai , Su Tao , Meng-Hui Lin 2000-12-19