Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Flip chip stacked package

Flip chip stacked package

US Patent 7291924 · Granted Nov 6, 2007

Estimated economic value: $565,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Process and apparatus for trimming polymeric parts2010
Flip-chip package2009
Multi-chips stacked package2007
Process of cutting electronic package2007
Multi-chips stacked package2007
Method for flip chip bonding by utilizing an interposer with embedded bumps2006
Heat sink for chip package and bonding method thereof2006
Semiconductor package with a heat spreader2006
Stacked semiconductor chip package2006
Flip chip package structure2006
Flip chip package capable of measuring bond line thickness of thermal interface 2006
Chip package structure with dual heat sinks2006