Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Multi-chip stack flip-chip package

Multi-chip stack flip-chip package

US Patent 6861761 · Granted Mar 1, 2005

Estimated economic value: $202,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Flip-chip package2009
Flip-chip package2009
Flip chip stacked package2007
Multi-chips stacked package2007
Multi-chips stacked package2007
Stack type flip-chip package2006
Heat sink for chip package and bonding method thereof2006
Semiconductor package with a heat spreader2006
Stacked semiconductor chip package2006
Flip chip package capable of measuring bond line thickness of thermal interface 2006
Multi-chips stacked package2006
High density semiconductor package2005