Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11467758 | Data writing method using different programming modes based on the number of available physical erasing units, memory control circuit unit and memory storage device | Chieh Yang, Yi-Hsuan Lin, Ping-Chuan Lin | 2022-10-11 |
| 10871914 | Memory management method, memory storage device and memory control circuit unit | Ping-Chuan Lin, Shii-Yeu Chern, Yi-Hsuan Lin, Chi-Shun Kao | 2020-12-22 |
| 10344383 | Semiconductor package device and method of manufacturing the same | Chuan-Yung Shih, Yu-Chi Wang, Chin-Feng Wang, Sing-Syuan Shiau, Chun-Wei Shih +3 more | 2019-07-09 |
| 10222209 | Measurement equipment | Seungbae Park, Yu-Ho Hsu, Chin-Li KAO | 2019-03-05 |
| 9891048 | Measurement equipment | Seungbae Park, Yu-Ho Hsu, Chin-Li KAO | 2018-02-13 |
| 8110931 | Wafer and semiconductor package | Hsiao-Chuan Chang, Tsung-Yueh Tsai, Yi-Shao Lai, Ho-Ming Tong, Jian-Cheng Chen +6 more | 2012-02-07 |
| 8059422 | Thermally enhanced package structure | Ho-Ming Tong, Shin-Hua Chao, Ming-Chiang Lee, Chao-Yuan Liu, Yung-Cheng Huang +3 more | 2011-11-15 |
| 7614888 | Flip chip package process | Ho-Ming Tong, Shin-Hua Chao, Ming-Chiang Lee, Chao-Yuan Liu, Yung-Cheng Huang +3 more | 2009-11-10 |
| 7466031 | Structure and method of forming metal buffering layer | — | 2008-12-16 |
| 7253508 | Semiconductor package with a flip chip on a solder-resist leadframe | Chien Liu, Hsueh-Te Wang, Meng-Jen Wang, Chi-Hao Chiu | 2007-08-07 |
| 7071544 | Wafer level assembly package | Chi-Yu Wang | 2006-07-04 |