Issued Patents All Time
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10056325 | Semiconductor package having a trench penetrating a main body | Chin-Li KAO, Chang-Chi Lee | 2018-08-21 |
| 9589840 | Semiconductor package and manufacturing method thereof | Chin-Li KAO, Chang-Chi Lee | 2017-03-07 |
| 8592982 | Semiconductor package having proximity communication signal input terminals and manufacturing methods thereof | Tsung-Yueh Tsai, Ming-Kun Chen, Tai-Ping Wang, Ming-Hsiang Cheng | 2013-11-26 |
| 8421242 | Semiconductor package | Hsiao-Chuan Chang, Tsung-Yueh Tsai, Chang-Lin Yeh, Ming-Hsiang Cheng | 2013-04-16 |
| 8368216 | Semiconductor package | Tsung-Yueh Tsai, Ming-Kun Chen, Hsiao-Chuan Chang, Ming-Hsiang Cheng | 2013-02-05 |
| 8274149 | Semiconductor device package having a buffer structure and method of fabricating the same | Hsiao-Chuan Chang, Tsung-Yueh Tsai, Ming-Hsiang Cheng | 2012-09-25 |
| 8253431 | Apparatus and method for testing non-contact pads of a semiconductor device to be tested | Tsung-Yueh Tsai, Ming-Kun Chen, I. L. Lin, Ken Juang, Ming-Hsiang Cheng | 2012-08-28 |
| 8222726 | Semiconductor device package having a jumper chip and method of fabricating the same | Hsiao-Chuan Chang, Tsung-Yueh Tsai, Jiunn Chen, Ming-Hsiang Cheng | 2012-07-17 |
| 8222733 | Semiconductor device package | Ming-Hsiang Cheng, Tsung-Yueh Tsai, Hsiao-Chuan Chang | 2012-07-17 |
| 8115285 | Advanced quad flat no lead chip package having a protective layer to enhance surface mounting and manufacturing methods thereof | Chien-Wen Chen, Hsiao-Chuan Chang, Tsung-Yueh Tsai, Pao-Huei Chang Chien, Ping Hu +1 more | 2012-02-14 |
| 8110931 | Wafer and semiconductor package | Hsiao-Chuan Chang, Tsung-Yueh Tsai, Ho-Ming Tong, Jian-Cheng Chen, Wei Chi Yih +6 more | 2012-02-07 |
| 8076786 | Semiconductor package and method for packaging a semiconductor package | Chang Ying Hung, Hsiao-Chuan Chang, Tsung-Yueh Tsai, Jian-Cheng Chen, Wei Chi Yih +1 more | 2011-12-13 |
| 8072064 | Semiconductor package and method for making the same | Tsung-Yueh Tsai, Ming-Kun Chen, Hsiao-Chuan Chang, Ming-Hsiang Cheng | 2011-12-06 |
| 8053906 | Semiconductor package and method for processing and bonding a wire | Hsiao-Chuan Chang, Tsung-Yueh Tsai, Ho-Ming Tong, Jian-Cheng Chen, Wei Chi Yih +3 more | 2011-11-08 |
| 8018075 | Semiconductor package, method for enhancing the bond of a bonding wire, and method for manufacturing a semiconductor package | Hsiao-Chuan Chang, Tsung-Yueh Tsai, Ho-Ming Tong, Jian-Cheng Chen, Wei Chi Yih +1 more | 2011-09-13 |
| 7980757 | Bonding strength measuring device | Tsung-Yueh Tsai, Hsiao-Chuan Chang | 2011-07-19 |
| 7964949 | Tenon-and-mortise packaging structure | Tsung-Yueh Tsai, Hsiao-Chuan Chang, Tsan-Hsien Chen | 2011-06-21 |
| 7955897 | Chip structure and stacked chip package as well as method for manufacturing chip structures | Tsung-Yueh Tsai, Cheng-Wei Huang | 2011-06-07 |
| 7482204 | Chip packaging process | Chin-Li KAO, Jeng-Da Wu, Tong-Hong Wang | 2009-01-27 |
| 7444884 | Tensile test method | — | 2008-11-04 |
| 7335982 | Chip package structure and chip packaging process | Chin-Li KAO, Jeng-Da Wu, Tong-Hong Wang | 2008-02-26 |
| 7329900 | Bonding strength testing device | Chang-Lin Yeh | 2008-02-12 |