| 10056325 |
Semiconductor package having a trench penetrating a main body |
Chin-Li KAO, Chang-Chi Lee |
2018-08-21 |
| 9589840 |
Semiconductor package and manufacturing method thereof |
Chin-Li KAO, Chang-Chi Lee |
2017-03-07 |
| 8592982 |
Semiconductor package having proximity communication signal input terminals and manufacturing methods thereof |
Tsung-Yueh Tsai, Ming-Kun Chen, Tai-Ping Wang, Ming-Hsiang Cheng |
2013-11-26 |
| 8421242 |
Semiconductor package |
Hsiao-Chuan Chang, Tsung-Yueh Tsai, Chang-Lin Yeh, Ming-Hsiang Cheng |
2013-04-16 |
| 8368216 |
Semiconductor package |
Tsung-Yueh Tsai, Ming-Kun Chen, Hsiao-Chuan Chang, Ming-Hsiang Cheng |
2013-02-05 |
| 8274149 |
Semiconductor device package having a buffer structure and method of fabricating the same |
Hsiao-Chuan Chang, Tsung-Yueh Tsai, Ming-Hsiang Cheng |
2012-09-25 |
| 8253431 |
Apparatus and method for testing non-contact pads of a semiconductor device to be tested |
Tsung-Yueh Tsai, Ming-Kun Chen, I. L. Lin, Ken Juang, Ming-Hsiang Cheng |
2012-08-28 |
| 8222726 |
Semiconductor device package having a jumper chip and method of fabricating the same |
Hsiao-Chuan Chang, Tsung-Yueh Tsai, Jiunn Chen, Ming-Hsiang Cheng |
2012-07-17 |
| 8222733 |
Semiconductor device package |
Ming-Hsiang Cheng, Tsung-Yueh Tsai, Hsiao-Chuan Chang |
2012-07-17 |
| 8115285 |
Advanced quad flat no lead chip package having a protective layer to enhance surface mounting and manufacturing methods thereof |
Chien-Wen Chen, Hsiao-Chuan Chang, Tsung-Yueh Tsai, Pao-Huei Chang Chien, Ping Hu +1 more |
2012-02-14 |
| 8110931 |
Wafer and semiconductor package |
Hsiao-Chuan Chang, Tsung-Yueh Tsai, Ho-Ming Tong, Jian-Cheng Chen, Wei Chi Yih +6 more |
2012-02-07 |
| 8076786 |
Semiconductor package and method for packaging a semiconductor package |
Chang Ying Hung, Hsiao-Chuan Chang, Tsung-Yueh Tsai, Jian-Cheng Chen, Wei Chi Yih +1 more |
2011-12-13 |
| 8072064 |
Semiconductor package and method for making the same |
Tsung-Yueh Tsai, Ming-Kun Chen, Hsiao-Chuan Chang, Ming-Hsiang Cheng |
2011-12-06 |
| 8053906 |
Semiconductor package and method for processing and bonding a wire |
Hsiao-Chuan Chang, Tsung-Yueh Tsai, Ho-Ming Tong, Jian-Cheng Chen, Wei Chi Yih +3 more |
2011-11-08 |
| 8018075 |
Semiconductor package, method for enhancing the bond of a bonding wire, and method for manufacturing a semiconductor package |
Hsiao-Chuan Chang, Tsung-Yueh Tsai, Ho-Ming Tong, Jian-Cheng Chen, Wei Chi Yih +1 more |
2011-09-13 |
| 7980757 |
Bonding strength measuring device |
Tsung-Yueh Tsai, Hsiao-Chuan Chang |
2011-07-19 |
| 7964949 |
Tenon-and-mortise packaging structure |
Tsung-Yueh Tsai, Hsiao-Chuan Chang, Tsan-Hsien Chen |
2011-06-21 |
| 7955897 |
Chip structure and stacked chip package as well as method for manufacturing chip structures |
Tsung-Yueh Tsai, Cheng-Wei Huang |
2011-06-07 |
| 7482204 |
Chip packaging process |
Chin-Li KAO, Jeng-Da Wu, Tong-Hong Wang |
2009-01-27 |
| 7444884 |
Tensile test method |
— |
2008-11-04 |
| 7335982 |
Chip package structure and chip packaging process |
Chin-Li KAO, Jeng-Da Wu, Tong-Hong Wang |
2008-02-26 |
| 7329900 |
Bonding strength testing device |
Chang-Lin Yeh |
2008-02-12 |