Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8378466 | Wafer-level semiconductor device packages with electromagnetic interference shielding | Chi-Tsung Chiu, Kuo-Hsien Liao, Yu-Chi Chen, Chen-Chuan Fan | 2013-02-19 |
| 8110931 | Wafer and semiconductor package | Hsiao-Chuan Chang, Tsung-Yueh Tsai, Yi-Shao Lai, Ho-Ming Tong, Jian-Cheng Chen +6 more | 2012-02-07 |
| 8076786 | Semiconductor package and method for packaging a semiconductor package | Chang Ying Hung, Hsiao-Chuan Chang, Tsung-Yueh Tsai, Yi-Shao Lai, Jian-Cheng Chen +1 more | 2011-12-13 |
| 8053906 | Semiconductor package and method for processing and bonding a wire | Hsiao-Chuan Chang, Tsung-Yueh Tsai, Yi-Shao Lai, Ho-Ming Tong, Jian-Cheng Chen +3 more | 2011-11-08 |
| 8018075 | Semiconductor package, method for enhancing the bond of a bonding wire, and method for manufacturing a semiconductor package | Hsiao-Chuan Chang, Tsung-Yueh Tsai, Yi-Shao Lai, Ho-Ming Tong, Jian-Cheng Chen +1 more | 2011-09-13 |