Patents per Year
Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 9578737 | Substrate structure and package structure using the same | Kuo-Hua Chen, Ming-Chiang Lee, Tsung-Hsun Lee | 2017-02-21 | $3,165,000 |
| 8665605 | Substrate structure and package structure using the same | Kuo-Hua Chen, Ming-Chiang Lee, Tsung-Hsun Lee | 2014-03-04 | $2,792,000 |
| 8378466 | Wafer-level semiconductor device packages with electromagnetic interference shielding | Chi-Tsung Chiu, Kuo-Hsien Liao, Wei Chi Yih, Yu-Chi Chen | 2013-02-19 | $1,460,000 |
| 8212339 | Semiconductor device packages with electromagnetic interference shielding | Kuo-Hsien Liao, Jian-Cheng Chen, Chi-Tsung Chiu, Chih-Pin Hung | 2012-07-03 | $585,000 |