Issued Patents All Time
Showing 25 most recent of 57 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12431453 | Electronic device package and method for manufacturing the same | Mei-Ju Lu, Chi-Han Chen, Chang-Yu Lin, Jr-Wei LIN | 2025-09-30 |
| 12300715 | Capacitor structure | Chang-Yu Huang, Yi-Hsuan Lin | 2025-05-13 |
| 12166009 | Semiconductor device packages and methods of manufacturing the same | Tang-Yuan Chen, Meng-Kai SHIH, Teck-Chong Lee, Shin-Luh TARNG | 2024-12-10 |
| 12132248 | Electronic device | Cheng-Yu Ho, Meng-Wei Hsieh | 2024-10-29 |
| 11894317 | Package structure and method for manufacturing the same | Po-Hsien Ke, Teck-Chong Lee | 2024-02-06 |
| 11837566 | Electronic device package and method for manufacturing the same | Mei-Ju Lu, Chi-Han Chen, Chang-Yu Lin, Jr-Wei LIN | 2023-12-05 |
| 11777191 | Semiconductor device package and method of manufacturing the same | Cheng-Yu Ho, Sheng-Chi Hsieh | 2023-10-03 |
| 11742324 | Semiconductor device packages and methods of manufacturing the same | Tang-Yuan Chen, Meng-Kai SHIH, Teck-Chong Lee, Shin-Luh TARNG | 2023-08-29 |
| 11621220 | Assembly structure and method for manufacturing the same | Yung-Shun Chang, Teck-Chong Lee, Chih-Yi Huang | 2023-04-04 |
| 11227823 | Wiring structure | Tang-Yuan Chen | 2022-01-18 |
| 11217502 | Semiconductor device packages and methods of manufacturing the same | Ian HU, Meng-Kai SHIH | 2022-01-04 |
| 11183474 | Electronic device package and method for manufacturing the same | Mei-Ju Lu, Chi-Han Chen, Chang-Yu Lin, Jr-Wei LIN | 2021-11-23 |
| 11139222 | Electronic device comprising heat pipe contacting a cover structure for heat dissipation | Jung-Che Tsai, Ian HU | 2021-10-05 |
| 11081420 | Substrate structure and semiconductor package structure | Hsin-En Chen, Ian HU | 2021-08-03 |
| 11075186 | Semiconductor package | Ian HU, Jia-Rung Ho, Jin-Feng Yang, Ping-Feng Yang | 2021-07-27 |
| 11011496 | Semiconductor device packages and methods of manufacturing the same | Tang-Yuan Chen, Meng-Kai SHIH, Teck-Chong Lee, Shin-Luh TARNG | 2021-05-18 |
| 10985085 | Semiconductor device package and method for manufacturing the same | Ian HU, Meng-Kai SHIH | 2021-04-20 |
| 10916429 | Semiconductor device packages and stacked package assemblies including high density interconnections | John Richard Hunt, William T. Chen, Chen-Chao Wang | 2021-02-09 |
| 10886263 | Stacked semiconductor package assemblies including double sided redistribution layers | William T. Chen, John Richard Hunt, Chen-Chao Wang, Chih-Yi Huang | 2021-01-05 |
| 10872861 | Semiconductor packages | Yong-Da Chiu, Shiu-Chih WANG, Shang-Kun Huang, Ying-Ta Chiu, Shin-Luh TARNG | 2020-12-22 |
| 10770369 | Semiconductor device package | Tang-Yuan Chen, Jin-Feng Yang, Meng-Kai SHIH | 2020-09-08 |
| 10658319 | Semiconductor devices and semiconductor packages | Dao-Long Chen, Ying-Ta Chiu, Ping-Feng Yang | 2020-05-19 |
| 10658257 | Semiconductor package structure, semiconductor wafer level package and semiconductor manufacturing process | Dao-Long Chen, Ming-Hung Chen | 2020-05-19 |
| 10600759 | Power and ground design for through-silicon via structure | Ying-Te Ou, Pao-Nan Lee | 2020-03-24 |
| 10553527 | Substrate and semiconductor device package | Dao-Long Chen | 2020-02-04 |