Issued Patents All Time
Showing 1–18 of 18 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11806710 | Semiconductor package structures and methods of manufacturing the same | Hsiao-Yen Lee, Chin-Cheng Kuo, Chung-Hao Chen | 2023-11-07 |
| 11119524 | Glitch mitigation in selectable output current mirrors with degeneration resistors | Christopher M. DOUGHERTY, Anindya Bhattacharya, Vaibhav PANDEY | 2021-09-14 |
| 10600759 | Power and ground design for through-silicon via structure | Chih-Pin Hung, Pao-Nan Lee | 2020-03-24 |
| 10236208 | Semiconductor package structure and method of manufacturing the same | Chin-Cheng Kuo, Pao-Nan Lee, Chih-Pin Hung | 2019-03-19 |
| 9768103 | Fabrication method of embedded chip substrate | Yung-Hui Wang | 2017-09-19 |
| 9728451 | Through silicon vias for semiconductor devices and manufacturing method thereof | Chen-Chao Wang | 2017-08-08 |
| 9711473 | Semiconductor die, semiconductor wafer and method for manufacturing the same | Chin-Cheng Kuo, Lu-Ming Lai | 2017-07-18 |
| 9253887 | Fabrication method of embedded chip substrate | Yung-Hui Wang | 2016-02-02 |
| 8963316 | Semiconductor device and method for manufacturing the same | Chih-Jing Hsu, Chieh-Chen Fu, Che-Hau Huang | 2015-02-24 |
| 8937387 | Semiconductor device with conductive vias | Che-Hau Huang | 2015-01-20 |
| 8841751 | Through silicon vias for semiconductor devices and manufacturing method thereof | Chen-Chao Wang | 2014-09-23 |
| 8653634 | EMI-shielded semiconductor devices and methods of making | Chi-Tsung Chiu | 2014-02-18 |
| 8486829 | Semiconductor element having a conductive via and method for making the same and package having a semiconductor element with a conductive via | Chi-Tsung Chiu, Meng-Jen Wang | 2013-07-16 |
| 8350361 | Semiconductor element having a conductive via and method for making the same and package having a semiconductor element with a conductive via | Chi-Tsung Chiu, Meng-Jen Wang | 2013-01-08 |
| 8222707 | Semiconductor package structure and package method thereof | — | 2012-07-17 |
| 8120148 | Package structure with embedded die and method of fabricating the same | Kuo-Hua Chen, Chieh-Chen Fu | 2012-02-21 |
| 8099865 | Method for manufacturing a circuit board having an embedded component therein | Yung-Hui Wang | 2012-01-24 |
| 7944707 | Package structure for connection with output/input module | Chih-Pin Hung | 2011-05-17 |