Issued Patents All Time
Showing 25 most recent of 39 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12417805 | Memory control circuit capable of generating an updated reference current | — | 2025-09-16 |
| 12278175 | Platform power integrity design including package standard power integrity model and compact voltage regulator module model | Xing Jian Cai, Chi-Te Chen, Wei Qian, Yihong Yang, Jue-Yao Chen +3 more | 2025-04-15 |
| 12237027 | Anti-fuse memory | Chi-Hsiu Hsu, Chi-Fa Lien, Ying-Ting Lin, Cheng-Hsiao Lai, Ya-Nan Mou | 2025-02-25 |
| 11806710 | Semiconductor package structures and methods of manufacturing the same | Hsiao-Yen Lee, Ying-Te Ou, Chin-Cheng Kuo | 2023-11-07 |
| 11784110 | Semiconductor package and method for manufacturing the same | Chin-Cheng Kuo | 2023-10-10 |
| 11417412 | Cell trace circuit for measuring I-V property of memory cell | Hsiao-Hua Lu | 2022-08-16 |
| 11313425 | Motor transmission unit for electronic parking brake device | — | 2022-04-26 |
| 11189574 | Microelectronic package having electromagnetic interference shielding | Li-Sheng Weng, James C. Matayabas, Jr., Min Keen Tang | 2021-11-30 |
| 11177680 | Field shaper for a wireless power transmitter | Jaejin Lee, Hao-Han Hsu | 2021-11-16 |
| 10950555 | Ultra-low profile package shielding technique using magnetic and conductive layers for integrated switching voltage regulator | Kaladhar Radhakrishnan, Jaejin Lee, Hao-Han Hsu, Dong-Ho Han | 2021-03-16 |
| 10910314 | Conductive coating for a microelectronics package | Li-Sheng Weng, Emile Davies-Venn, Kemal Aygun, Mitul Modi | 2021-02-02 |
| 10854533 | Semiconductor package and method for manufacturing the same | Chin-Cheng Kuo | 2020-12-01 |
| 10736246 | Electromagnetic interference shielding having a magnetically attracted shield arm | Jaejin Lee, Hao-Han Hsu, Xiang Li, Jun Liao | 2020-08-04 |
| 10580499 | Read only memory | Hsin-Pang Lu, Chi-Hsiu Hsu, Ya-Nan Mou, Chung-Cheng Tsai | 2020-03-03 |
| 10530174 | Shield for a wireless power transmitter | Jaejin Lee, Zhen Yao, Songnan Yang, Jonathan Rosenfeld, Sreenivas Kasturi | 2020-01-07 |
| 10510667 | Conductive coating for a microelectronics package | Li-Sheng Weng, Emile Davies-Venn, Kemal Aygun, Mitul Modi | 2019-12-17 |
| 10418940 | Radio frequency interference mitigation in crystal oscillator circuitry | Hao-Han Hsu, Jaejin Lee | 2019-09-17 |
| 10403581 | Electronic device packages with attenuated electromagnetic interference signals | Jaejin Lee, Hao-Han Hsu, Dong-Ho Han | 2019-09-03 |
| 10403973 | EBG designs for mitigating radio frequency interference | — | 2019-09-03 |
| 10269716 | Device, system and method to interconnect circuit components on a transparent substrate | Vijay Kasturi, Ana M. Yepes, Bradley A. Jackson | 2019-04-23 |
| 9900976 | Integrated circuit package including floating package stiffener | Min Keen Tang, Li-Sheng Weng | 2018-02-20 |
| 9755334 | Retention mechanism for shielded flex cable to improve EMI/RFI for high speed signaling | Xiang Li, Yun Ling, Hao-Han Hsu, Shyamjith Mohan, Kuan-Yu Chen | 2017-09-05 |
| 9705182 | Patch-based proximity sensors, antennas, and control systems to control antennas based on corresponding proximity measures | Hao-Han Hsu, Songnan Yang, Dong-Ho Han | 2017-07-11 |
| 9609765 | Chassis of electronic device | Xiaoguo Liang, Alexander B. Uan-Zo-Li, Sheng Ren, Hong W. Wong | 2017-03-28 |
| 9596749 | Circuit board having a signal layer with signal traces and a reference plane with an additional signal trace larger than the signal traces | Kuan-Yu Chen, Yun Ling, Mohd Muhaiyiddin Bin Abdullah, Jackson Chung Peng Kong, Hao-Han Hsu +1 more | 2017-03-14 |