| 12431416 |
Chip package with integrated current control |
Chun-Yuan Cheng, Chao-Chin Lee |
2025-09-30 |
| 12354978 |
Coupled loop and void structure integrated in a redistribution layer of a chip package |
Po-Wei Chiu, Tzu-No Chen, Hong Shi, Young-Soo Lee |
2025-07-08 |
| 12355000 |
Package comprising a substrate and a high-density interconnect integrated device |
Yangyang SUN, Zhimin Song |
2025-07-08 |
| 12136613 |
Chip package with near-die integrated passive device |
Suresh Ramalingam, Hong Shi |
2024-11-05 |
| 11784157 |
Package comprising integrated devices coupled through a metallization layer |
Charles David Paynter, Ryan David Lane, Jianwen Xu, William Stone |
2023-10-10 |
| 11676922 |
Integrated device comprising interconnect structures having an inner interconnect, a dielectric layer and a conductive layer |
Yue Li, Yangyang SUN |
2023-06-13 |
| 11605594 |
Package comprising a substrate and a high-density interconnect integrated device coupled to the substrate |
Ryan David Lane, Charles David Paynter, Eric David Foronda |
2023-03-14 |
| 11594491 |
Multi-die interconnect |
Hong Bok We |
2023-02-28 |
| 11380613 |
Repurposed seed layer for high frequency noise control and electrostatic discharge connection |
Yue Li, Yangyang SUN |
2022-07-05 |
| 11189574 |
Microelectronic package having electromagnetic interference shielding |
Chung-Hao Chen, James C. Matayabas, Jr., Min Keen Tang |
2021-11-30 |
| 11139224 |
Package comprising a substrate having a via wall configured as a shield |
Chaoqi Zhang, Rajneesh Kumar, Darryl Sheldon JESSIE, Suhyung Hwang, Jeahyeong Han +2 more |
2021-10-05 |
| 10910314 |
Conductive coating for a microelectronics package |
Chung-Hao Chen, Emile Davies-Venn, Kemal Aygun, Mitul Modi |
2021-02-02 |
| 10658198 |
Solder resist layer structures for terminating de-featured components and methods of making the same |
Chi-Te Chen, Wei-Lun Kane Jen, Olivia Chen, Yun Ling |
2020-05-19 |
| 10510667 |
Conductive coating for a microelectronics package |
Chung-Hao Chen, Emile Davies-Venn, Kemal Aygun, Mitul Modi |
2019-12-17 |
| 10244632 |
Solder resist layer structures for terminating de-featured components and methods of making the same |
Chi-Te Chen, Wei-Lun Kane Jen, Olivia Chen, Yun Ling |
2019-03-26 |
| 9900976 |
Integrated circuit package including floating package stiffener |
Chung-Hao Chen, Min Keen Tang |
2018-02-20 |