Issued Patents All Time
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12315986 | Antenna and device configurations | Seong Heon Jeong, Rajneesh Kumar, Mohammad Ali Tassoudji, Gurkanwal Singh Sahota, Kevin Hsi Huai Wang +7 more | 2025-05-27 |
| 12293980 | Package comprising discrete antenna device | Jaehyun Yeon, Suhyung Hwang, Chin-Kwan Kim, Rajneesh Kumar | 2025-05-06 |
| 12212082 | Antenna system with floating conductor | Mahmoud Niroo Jazi, Mohammad Ali Tassoudji, Taesik Yang, Jeongil Jay Kim, Kevin Hsi Huai Wang +2 more | 2025-01-28 |
| 12119558 | Integrated antenna module | Julio Zegarra, Peter Lien, Sang-June Park, Alberto Cicalini, Sean Oak +1 more | 2024-10-15 |
| 11804865 | Antenna tuner | Hong-Ming Lee | 2023-10-31 |
| 11735804 | Multi-core broadband PCB antenna | Chaoqi Zhang, Suhyung Hwang, Jaehyun Yeon, Taesik Yang, Jeongil Jay Kim +1 more | 2023-08-22 |
| 11735819 | Compact patch and dipole interleaved array antenna | Jeongil Jay Kim, Sangkil KIM | 2023-08-22 |
| 11696390 | Systems for shielding bent signal lines | Jeahyeong Han, Suhyung Hwang, Mina Iskander, Rajneesh Kumar | 2023-07-04 |
| 11594823 | Discrete antenna module with via wall structure | Taesik Yang, Mohammad Ali Tassoudji, Jeongil Jay Kim, Kevin Hsi Huai Wang | 2023-02-28 |
| 11594824 | Integrated antenna module | Julio Zegarra, Peter Lien, Sang-June Park, Alberto Cicalini, Sean Oak +1 more | 2023-02-28 |
| 11495873 | Device comprising multi-directional antennas in substrates coupled through flexible interconnects | Jeahyeong Han, Rajneesh Kumar, Suhyung Hwang, Jaehyun Yeon, Mohammad Ali Tassoudji +1 more | 2022-11-08 |
| 11406006 | Electromagnetic (EM) field rotation for interconnection between chip and circuit board | Xiaoming Chen | 2022-08-02 |
| 11322855 | Slow-wave RF transmission network | Mina Iskander, Avantika Sodhi | 2022-05-03 |
| 11245175 | Antenna module configurations | Seong Heon Jeong, Rajneesh Kumar, Mohammad Ali Tassoudji, Gurkanwal Singh Sahota, Kevin Hsi Huai Wang +7 more | 2022-02-08 |
| 11139224 | Package comprising a substrate having a via wall configured as a shield | Chaoqi Zhang, Rajneesh Kumar, Li-Sheng Weng, Suhyung Hwang, Jeahyeong Han +2 more | 2021-10-05 |
| 9985591 | Differential source follower driven power amplifier | Jeremy Goldblatt | 2018-05-29 |
| 9537197 | Transmission line implementation in wafer-level packaging | Lan Nan | 2017-01-03 |
| 7460001 | Variable inductor for integrated circuit and printed circuit board | — | 2008-12-02 |
| 7271465 | Integrated circuit with low-loss primary conductor strapped by lossy secondary conductor | Charles J. Persico | 2007-09-18 |