| 12300873 |
Antenna modules employing a package substrate with a vertically-integrated patch antenna(s), and related fabrication methods |
Suhyung Hwang, Kun Fang, Chin-Kwan Kim, Taesik Yang |
2025-05-13 |
| 12293980 |
Package comprising discrete antenna device |
Suhyung Hwang, Chin-Kwan Kim, Rajneesh Kumar, Darryl Sheldon JESSIE |
2025-05-06 |
| 12125742 |
Package comprising a substrate with high density interconnects |
Hyunchul CHO, Kun Fang, Suhyung Hwang |
2024-10-22 |
| 12126071 |
Multi-directional antenna modules employing a surface-mount antenna(s) to support antenna pattern multi-directionality, and related fabrication methods |
Kun Fang, Suhyung Hwang, Hyunchul CHO |
2024-10-22 |
| 11869833 |
Package comprising a substrate with a via interconnect coupled to a trace interconnect and method of fabricating the same |
Kun Fang, Suhyung Hwang, Hyunchul CHO |
2024-01-09 |
| 11823983 |
Package with a substrate comprising pad-on-pad interconnects |
Kun Fang, Suhyung Hwang, Hong Bok We |
2023-11-21 |
| 11764489 |
Sub-module L-shaped millimeter wave antenna-in-package |
Milind Shah, Chin-Kwan Kim, Rajneesh Kumar, Suhyung Hwang |
2023-09-19 |
| 11735804 |
Multi-core broadband PCB antenna |
Chaoqi Zhang, Suhyung Hwang, Taesik Yang, Jeongil Jay Kim, Darryl Sheldon JESSIE +1 more |
2023-08-22 |
| 11637057 |
Uniform via pad structure having covered traces between partially covered pads |
Kuiwon Kang, Chin-Kwan Kim, Aniket PATIL |
2023-04-25 |
| 11551939 |
Substrate comprising interconnects embedded in a solder resist layer |
Kun Fang, Suhyung Hwang, Hong Bok We |
2023-01-10 |
| 11545425 |
Substrate comprising interconnects embedded in a solder resist layer |
Kun Fang, Suhyung Hwang, Hong Bok We |
2023-01-03 |
| 11495873 |
Device comprising multi-directional antennas in substrates coupled through flexible interconnects |
Jeahyeong Han, Rajneesh Kumar, Suhyung Hwang, Mohammad Ali Tassoudji, Darryl Sheldon JESSIE +1 more |
2022-11-08 |
| 11439008 |
Package with substrate comprising variable thickness solder resist layer |
Kun Fang, Suhyung Hwang, Hyunchul CHO, Boyu Tseng |
2022-09-06 |
| 11399435 |
Device comprising multi-directional antennas coupled through a flexible printed circuit board |
Suhyung Hwang, Rajneesh Kumar, Jeahyeong Han |
2022-07-26 |
| 11258165 |
Asymmetric antenna structure |
Hong Bok We, Chin-Kwan Kim, Suhyung Hwang |
2022-02-22 |
| 11239573 |
Sub-module L-shaped millimeter wave antenna-in-package |
Milind Shah, Chin-Kwan Kim, Rajneesh Kumar, Suhyung Hwang |
2022-02-01 |
| 11183446 |
X.5 layer substrate |
Suhyung Hwang, Hong Bok We, Kun Fang |
2021-11-23 |
| 11139224 |
Package comprising a substrate having a via wall configured as a shield |
Chaoqi Zhang, Rajneesh Kumar, Li-Sheng Weng, Darryl Sheldon JESSIE, Suhyung Hwang +2 more |
2021-10-05 |
| 11101220 |
Through-package partial via on package edge |
Hong Bok We, Aniket PATIL |
2021-08-24 |
| 11075260 |
Substrate comprising recessed interconnects and a surface mounted passive component |
Kuiwon Kang, Chin-Kwan Kim, Hong Bok We |
2021-07-27 |
| 11043740 |
Enhanced antenna module with shield layer |
Suhyung Hwang, Chin-Kwan Kim, Hong Bok We |
2021-06-22 |