| 12500146 |
Substrate(s) for an integrated circuit (IC) package employing a metal core for improved electrical shielding and structural strength, and related IC packages and fabrication methods |
Min Sang Kim, Hong Bok We, Joan Rey Villarba BUOT |
2025-12-16 |
|
| 12424559 |
Package with a substrate comprising embedded escape interconnects and surface escape interconnects |
Hong Bok We, Michelle Yejin Kim |
2025-09-23 |
|
| 12362269 |
Integrated circuit (IC) packages employing supplemental metal layer coupled to embedded metal traces in a die-side embedded trace substrate (ETS) layer, and related fabrication methods |
Michelle Yejin Kim, Joan Rey Villarba BUOT, Ching-Liou Huang |
2025-07-15 |
|
| 12354935 |
Integrated circuit (IC) package substrate with embedded trace substrate (ETS) layer on a substrate, and related fabrication methods |
Chin-Kwan Kim, Joonsuk Park |
2025-07-08 |
|
| 11791320 |
Integrated circuit (IC) packages employing a package substrate with a double side embedded trace substrate (ETS), and related fabrication methods |
Hong Bok We, Joan Rey Villarba BUOT, Michelle Yejin Kim, Aniket PATIL |
2023-10-17 |
$7,437,000 |
| 11776888 |
Package with a substrate comprising protruding pad interconnects |
Hong Bok We, Chin-Kwan Kim, Milind Shah |
2023-10-03 |
$8,168,000 |
| 11764076 |
Semi-embedded trace structure with partially buried traces |
Joan Rey Villarba BUOT, Terence Cheung |
2023-09-19 |
$10,581,000 |
| 11676905 |
Integrated circuit (IC) package with stacked die wire bond connections, and related methods |
Michelle Yejin Kim, Joan Rey Villarba BUOT, Jialing Tong |
2023-06-13 |
$11,694,000 |
| 11637057 |
Uniform via pad structure having covered traces between partially covered pads |
Chin-Kwan Kim, Aniket PATIL, Jaehyun Yeon |
2023-04-25 |
$11,116,000 |
| 11605595 |
Packages with local high-density routing region embedded within an insulating layer |
Aniket PATIL, Hong Bok We |
2023-03-14 |
$15,604,000 |
| 11552023 |
Passive component embedded in an embedded trace substrate (ETS) |
Brigham NAVAJA, Marcus HSU, Terence Cheung |
2023-01-10 |
$15,777,000 |
| 11552015 |
Substrate comprising a high-density interconnect portion embedded in a core layer |
Aniket PATIL, Hong Bok We |
2023-01-10 |
$15,777,000 |
| 11545439 |
Package comprising an integrated device coupled to a substrate through a cavity |
Aniket PATIL, Hong Bok We |
2023-01-03 |
$13,583,000 |
| 11545435 |
Double sided embedded trace substrate |
Zhijie Wang, Hong Bok We |
2023-01-03 |
$13,583,000 |
| 11527498 |
Bump pad structure |
Michelle Yejin Kim, Marcus HSU |
2022-12-13 |
$27,878,000 |
| 11444019 |
Package comprising a substrate with interconnect routing over solder resist layer and an integrated device coupled to the substrate and method for manufacturing the package |
Aniket PATIL, Hong Bok We |
2022-09-13 |
$23,094,000 |
| 11437335 |
Integrated circuit (IC) packages employing a thermal conductive package substrate with die region split, and related fabrication methods |
Aniket PATIL, Bohan Yan, Dongming He |
2022-09-06 |
$16,070,000 |
| 11404343 |
Package comprising a substrate configured as a heat spreader |
David Fraser Rae, John Holmes, Marcus HSU, Avantika Sodhi |
2022-08-02 |
$22,443,000 |
| 11342254 |
Multi-dielectric structure in two-layer embedded trace substrate |
Joan Rey Villarba BUOT, Joonsuk Park, Karthikeyan Dhandapani |
2022-05-24 |
$33,292,000 |
| 11075260 |
Substrate comprising recessed interconnects and a surface mounted passive component |
Chin-Kwan Kim, Hong Bok We, Jaehyun Yeon |
2021-07-27 |
$31,126,000 |
| 10971455 |
Ground shield plane for ball grid array (BGA) package |
Aniket PATIL, Zhijie Wang, Ming Yi |
2021-04-06 |
$25,507,000 |
| 10879158 |
Split conductive pad for device terminal |
Aniket PATIL, Hong Bok We, Zhijie Wang |
2020-12-29 |
$26,776,000 |
| 10804195 |
High density embedded interconnects in substrate |
Marcus HSU, Brigham NAVAJA, Houssam Jomaa |
2020-10-13 |
$32,150,000 |
| 10679919 |
High thermal release interposer |
Zhijie Wang, Bohan Yan |
2020-06-09 |
$13,502,000 |
| 10651160 |
Low profile integrated package |
Houssam Jomaa, Christopher Bahr, Layal Rouhana |
2020-05-12 |
$14,443,000 |
