Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12424559 | Package with a substrate comprising embedded escape interconnects and surface escape interconnects | Kuiwon Kang, Hong Bok We | 2025-09-23 |
| 12362269 | Integrated circuit (IC) packages employing supplemental metal layer coupled to embedded metal traces in a die-side embedded trace substrate (ETS) layer, and related fabrication methods | Kuiwon Kang, Joan Rey Villarba BUOT, Ching-Liou Huang | 2025-07-15 |
| 11791320 | Integrated circuit (IC) packages employing a package substrate with a double side embedded trace substrate (ETS), and related fabrication methods | Hong Bok We, Joan Rey Villarba BUOT, Kuiwon Kang, Aniket PATIL | 2023-10-17 |
| 11676905 | Integrated circuit (IC) package with stacked die wire bond connections, and related methods | Kuiwon Kang, Joan Rey Villarba BUOT, Jialing Tong | 2023-06-13 |
| 11527498 | Bump pad structure | Kuiwon Kang, Marcus HSU | 2022-12-13 |