Issued Patents All Time
Showing 25 most recent of 47 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12381174 | Integrated circuit (IC) packages employing wire bond channel over package substrate, and related fabrication methods | Hong Bok We, Joan Rey Villarba BUOT | 2025-08-05 |
| 12288710 | Wafer processing apparatus with a rotatable table | Theodorus G.M. Oosterlaken, Nimit Kothari | 2025-04-29 |
| 12243855 | Package comprising channel interconnects located between solder interconnects | Durodami LISK, Hong Bok We, Charles David Paynter | 2025-03-04 |
| 12230552 | Recess structure for padless stack via | Hong Bok We, Joan Rey Villarba BUOT | 2025-02-18 |
| 12100645 | Integrated circuit (IC) package employing added metal for embedded metal traces in ETS-based substrate for reduced signal path impedance, and related fabrication methods | Hong Bok We, Joan Rey Villarba BUOT | 2024-09-24 |
| 12021063 | Circular bond finger pad | Joan Rey Villarba BUOT, Zhijie Wang, Hong Bok We | 2024-06-25 |
| 11955409 | Substrate comprising interconnects in a core layer configured for skew matching | Joan Rey Villarba BUOT, Hong Bok We | 2024-04-09 |
| 11948877 | Hybrid package apparatus and method of fabricating | Hong Bok We, Brigham NAVAJA | 2024-04-02 |
| 11946137 | Runout and wobble measurement fixtures | Saket Rathi, Sam Kim, Shiva K.T. Rajavelu Muralidhar | 2024-04-02 |
| 11889650 | Integrated direct mount branch protection for variable frequency drive | Mayur Kothari, Sudershan Gawali | 2024-01-30 |
| 11832391 | Terminal connection routing and method the same | Hong Bok We, Joan Rey Villarba BUOT | 2023-11-28 |
| 11817365 | Thermal mitigation die using back side etch | Hong Bok We, Jonghae Kim | 2023-11-14 |
| 11804645 | Multi-sided antenna module employing antennas on multiple sides of a package substrate for enhanced antenna coverage, and related fabrication methods | Hong Bok We, Joan Rey Villarba BUOT | 2023-10-31 |
| 11791320 | Integrated circuit (IC) packages employing a package substrate with a double side embedded trace substrate (ETS), and related fabrication methods | Hong Bok We, Joan Rey Villarba BUOT, Michelle Yejin Kim, Kuiwon Kang | 2023-10-17 |
| 11791276 | Package comprising passive component between substrates for improved power distribution network (PDN) performance | Hong Bok We, Joan Rey Villarba BUOT | 2023-10-17 |
| 11784151 | Redistribution layer connection | Hong Bok We, Marcus HSU | 2023-10-10 |
| 11769732 | Integrated circuit (IC) with reconstituted die interposer for improved connectivity, and related methods of fabrication | Jonghae Kim | 2023-09-26 |
| 11749579 | Thermal structures adapted to electronic device heights in integrated circuit (IC) packages | Hong Bok We, Bohan Yan | 2023-09-05 |
| 11749611 | Package with a substrate comprising periphery interconnects | Hong Bok We | 2023-09-05 |
| 11715688 | Variable dielectric constant materials in same layer of a package | Hong Bok We | 2023-08-01 |
| 11682607 | Package having a substrate comprising surface interconnects aligned with a surface of the substrate | Hong Bok We, Marcus HSU | 2023-06-20 |
| 11658391 | Antenna module | Hong Bok We, Jeahyeong Han, Mohammad Ali Tassoudji | 2023-05-23 |
| 11637057 | Uniform via pad structure having covered traces between partially covered pads | Kuiwon Kang, Chin-Kwan Kim, Jaehyun Yeon | 2023-04-25 |
| 11605595 | Packages with local high-density routing region embedded within an insulating layer | Hong Bok We, Kuiwon Kang | 2023-03-14 |
| 11581262 | Package comprising a die and die side redistribution layers (RDL) | Brigham NAVAJA, Hong Bok We, Yuzhe ZHANG | 2023-02-14 |