Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11784151 | Redistribution layer connection | Aniket PATIL, Hong Bok We | 2023-10-10 |
| 11682607 | Package having a substrate comprising surface interconnects aligned with a surface of the substrate | Hong Bok We, Aniket PATIL | 2023-06-20 |
| 11552023 | Passive component embedded in an embedded trace substrate (ETS) | Kuiwon Kang, Brigham NAVAJA, Terence Cheung | 2023-01-10 |
| 11527498 | Bump pad structure | Kuiwon Kang, Michelle Yejin Kim | 2022-12-13 |
| 11456291 | Integrated circuit (IC) packages employing split, double-sided metallization structures to facilitate a semiconductor die (“die”) module employing stacked dice, and related fabrication methods | Hong Bok We, Aniket PATIL | 2022-09-27 |
| 11404343 | Package comprising a substrate configured as a heat spreader | David Fraser Rae, John Holmes, Kuiwon Kang, Avantika Sodhi | 2022-08-02 |
| 10804195 | High density embedded interconnects in substrate | Kuiwon Kang, Brigham NAVAJA, Houssam Jomaa | 2020-10-13 |
| 9484327 | Package-on-package structure with reduced height | Chin-Kwan Kim, Omar J. Bchir, Milind Shah, David Fraser Rae | 2016-11-01 |