Marcus HSU — 8 Patents at Qualcomm

Marcus HSU has been granted 8 US patents while listed as an inventor at Qualcomm. The first was granted in 2016 and the most recent in October 2023. Marcus HSU ranks #600,572 of 4,157,543 US inventors in our database (top 14.4%). Patent records list Marcus HSU in San Diego, CA, US.

Issued Patents All Time

Showing 1–8 of 8 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
11784151	Redistribution layer connection	Aniket PATIL, Hong Bok We	2023-10-10	$11,761,000
11682607	Package having a substrate comprising surface interconnects aligned with a surface of the substrate	Hong Bok We, Aniket PATIL	2023-06-20	$12,872,000
11552023	Passive component embedded in an embedded trace substrate (ETS)	Kuiwon Kang, Brigham NAVAJA, Terence Cheung	2023-01-10	$15,777,000
11527498	Bump pad structure	Kuiwon Kang, Michelle Yejin Kim	2022-12-13	$27,878,000
11456291	Integrated circuit (IC) packages employing split, double-sided metallization structures to facilitate a semiconductor die (“die”) module employing stacked dice, and related fabrication methods	Hong Bok We, Aniket PATIL	2022-09-27	$28,302,000
11404343	Package comprising a substrate configured as a heat spreader	David Fraser Rae, John Holmes, Kuiwon Kang, Avantika Sodhi	2022-08-02	$22,443,000
10804195	High density embedded interconnects in substrate	Kuiwon Kang, Brigham NAVAJA, Houssam Jomaa	2020-10-13	$32,150,000
9484327	Package-on-package structure with reduced height	Chin-Kwan Kim, Omar J. Bchir, Milind Shah, David Fraser Rae	2016-11-01	$12,885,000

Marcus HSU — 8 Patents

Issued Patents All Time

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