| 11784151 |
Redistribution layer connection |
Aniket PATIL, Hong Bok We |
2023-10-10 |
| 11682607 |
Package having a substrate comprising surface interconnects aligned with a surface of the substrate |
Hong Bok We, Aniket PATIL |
2023-06-20 |
| 11552023 |
Passive component embedded in an embedded trace substrate (ETS) |
Kuiwon Kang, Brigham NAVAJA, Terence Cheung |
2023-01-10 |
| 11527498 |
Bump pad structure |
Kuiwon Kang, Michelle Yejin Kim |
2022-12-13 |
| 11456291 |
Integrated circuit (IC) packages employing split, double-sided metallization structures to facilitate a semiconductor die (“die”) module employing stacked dice, and related fabrication methods |
Hong Bok We, Aniket PATIL |
2022-09-27 |
| 11404343 |
Package comprising a substrate configured as a heat spreader |
David Fraser Rae, John Holmes, Kuiwon Kang, Avantika Sodhi |
2022-08-02 |
| 10804195 |
High density embedded interconnects in substrate |
Kuiwon Kang, Brigham NAVAJA, Houssam Jomaa |
2020-10-13 |
| 9484327 |
Package-on-package structure with reduced height |
Chin-Kwan Kim, Omar J. Bchir, Milind Shah, David Fraser Rae |
2016-11-01 |