Patents per Year
Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11948877 | Hybrid package apparatus and method of fabricating | Aniket PATIL, Hong Bok We | 2024-04-02 | $17,562,000 |
| 11581262 | Package comprising a die and die side redistribution layers (RDL) | Aniket PATIL, Hong Bok We, Yuzhe ZHANG | 2023-02-14 | $12,121,000 |
| 11552023 | Passive component embedded in an embedded trace substrate (ETS) | Kuiwon Kang, Marcus HSU, Terence Cheung | 2023-01-10 | $15,777,000 |
| 11177223 | Electromagnetic interference shielding for packages and modules | Aniket PATIL, Hong Bok We | 2021-11-16 | $40,573,000 |
| 10804195 | High density embedded interconnects in substrate | Kuiwon Kang, Marcus HSU, Houssam Jomaa | 2020-10-13 | $32,150,000 |