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Semi-embedded trace structure with partially buried traces |
Kuiwon Kang, Joan Rey Villarba BUOT |
2023-09-19 |
| 11552023 |
Passive component embedded in an embedded trace substrate (ETS) |
Kuiwon Kang, Brigham NAVAJA, Marcus HSU |
2023-01-10 |
| 11437307 |
Device comprising first solder interconnects aligned in a first direction and second solder interconnects aligned in a second direction |
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Device comprising first solder interconnects aligned in a first direction and second solder interconnects aligned in a second direction |
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| 9209106 |
Thermal management circuit board for stacked semiconductor chip device |
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| 8314474 |
Under bump metallization for on-die capacitor |
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| 8012874 |
Semiconductor chip substrate with multi-capacitor footprint |
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2011-09-06 |