Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11764076 | Semi-embedded trace structure with partially buried traces | Kuiwon Kang, Joan Rey Villarba BUOT | 2023-09-19 |
| 11552023 | Passive component embedded in an embedded trace substrate (ETS) | Kuiwon Kang, Brigham NAVAJA, Marcus HSU | 2023-01-10 |
| 11437307 | Device comprising first solder interconnects aligned in a first direction and second solder interconnects aligned in a second direction | Abdolreza Langari, Yuan LI, Shrestha Ganguly, Ching-Liou Huang, Hui Wang | 2022-09-06 |
| 10916494 | Device comprising first solder interconnects aligned in a first direction and second solder interconnects aligned in a second direction | Abdolreza Langari, Yuan LI, Shrestha Ganguly, Ching-Liou Huang, Hui Wang | 2021-02-09 |
| 9209106 | Thermal management circuit board for stacked semiconductor chip device | Xiao Ling Shi, Suming Hu, Liane Martinez, Roden R. Topacio | 2015-12-08 |
| 8314474 | Under bump metallization for on-die capacitor | Neil McLellan, Fei Guo, Daniel A. Chung | 2012-11-20 |
| 8012874 | Semiconductor chip substrate with multi-capacitor footprint | Yue Li, Silqun Leung, Sally Yeung, Liane Martinez | 2011-09-06 |