Home › AMD › Roden R. Topacio

RT

Roden R. Topacio — 37 Patents

AMD: 44 patents #179 of 9,280Top 2%

Markham, CA: #18 of 1,673 inventorsTop 2%

Overall (All Time): #88,321 of 4,157,543Top 3%

37 Patents All Time

Roden R. Topacio has been granted 37 US patents while listed as an inventor at AMD. The first was granted in 2010 and the most recent in November 2024. Roden R. Topacio ranks #88,321 of 4,157,543 US inventors in our database (top 2.1%). Patent records list Roden R. Topacio in Markham, ON, CA.

Patents per Year

Issued Patents All Time

Showing 1–25 of 37 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
12148715	Electronic device including a substrate, a structure, and an adhesive and a process of forming the same	—	2024-11-19
11942405	Semiconductor package assembly using a passive device as a standoff	Jianguo Li	2024-03-26
11335659	Semiconductor chip with patterned underbump metallization and polymer film	Suming Hu, Yip Seng Low	2022-05-17
11315883	Integrated circuit product customizations for identification code visibility	Suming Hu, Farshad Ghahghahi, Jianguo Li, Andrew Kwan Wai Leung	2022-04-26	$716,201,000
10431533	Circuit board with constrained solder interconnect pads	Andrew KW Leung	2019-10-01
10403589	Interconnect etch with polymer layer edge protection	—	2019-09-03
9728518	Interconnect etch with polymer layer edge protection	—	2017-08-08
9576923	Semiconductor chip with patterned underbump metallization and polymer film	Suming Hu, Yip Seng Low	2017-02-21
9318457	Methods of fabricating semiconductor chip solder structures	Neil McLellan	2016-04-19
9209106	Thermal management circuit board for stacked semiconductor chip device	Xiao Ling Shi, Suming Hu, Liane Martinez, Terence Cheung	2015-12-08
9142520	Methods of fabricating semiconductor chip solder structures	Neil McLellan	2015-09-22
9059159	Routing layer for mitigating stress in a semiconductor die	Gabriel Wong	2015-06-16
9035471	Routing layer for mitigating stress in a semiconductor die	Gabriel Wong	2015-05-19
8927344	Die substrate with reinforcement structure	Adam Zbrzezny	2015-01-06
8847383	Integrated circuit package strip with stiffener	Neil McLellan, Vincent Chan	2014-09-30
8772083	Solder mask with anchor structures	Andrew KW Leung, Yu-Ling Hsieh, Yip Seng Low	2014-07-08	$2,496,000
8664777	Routing layer for mitigating stress in a semiconductor die	Gabriel Wong	2014-03-04
8647974	Method of fabricating a semiconductor chip with supportive terminal pad	Michael Z. Su, Neil McLellan	2014-02-11	$6,027,000
8642463	Routing layer for mitigating stress in a semiconductor die	Gabriel Wong	2014-02-04
8637983	Face-to-face (F2F) hybrid structure for an integrated circuit	Liane Martinez, Yip Seng Low	2014-01-28
8633599	Semiconductor chip with underfill anchors	Neil McLellan	2014-01-21	$3,762,000
8389340	Methods of forming semiconductor chip underfill anchors	Neil McLellan	2013-03-05
8378471	Semiconductor chip bump connection apparatus and method	Vincent Chan, Fan Yeung	2013-02-19
8313984	Die substrate with reinforcement structure	Adam Zbrzezny	2012-11-20
8298945	Method of manufacturing substrates having asymmetric buildup layers	Andrew KW Leung, Liane Martinez, Yip Seng Low	2012-10-30