Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8927344 | Die substrate with reinforcement structure | Roden R. Topacio | 2015-01-06 |
| 8785317 | Wafer level packaging of semiconductor chips | Neil McLellan | 2014-07-22 |
| 8344505 | Wafer level packaging of semiconductor chips | Neil McLellan | 2013-01-01 |
| 8313984 | Die substrate with reinforcement structure | Roden R. Topacio | 2012-11-20 |
| 7888259 | Integrated circuit package employing predetermined three-dimensional solder pad surface and method for making same | Roden R. Topacio | 2011-02-15 |