Issued Patents All Time
Showing 25 most recent of 78 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9867282 | Circuit board with corner hollows | Suming Hu, Andrew Kwan Wai Leung, Jianguo Li | 2018-01-09 |
| 9793199 | Circuit board with via trace connection and method of making the same | Andrew KW Leung, Yip Seng Low | 2017-10-17 |
| 9607935 | Semiconductor chip package with undermount passive devices | Liane Martinez, Silqun Leung, Gabriel Wong | 2017-03-28 |
| 9520306 | Method of fabricating an integrated circuit (IC) package having a plurality of spaced apart pad portion | Geraldine Tsui Yee Lin, Walter de Munnik, Kin Pui Kwan, Wing Him Lau, Kwok Cheung Tsang +1 more | 2016-12-13 |
| 9449903 | Ball grid array package with improved thermal characteristics | Ming Wang Sze, Kwok Cheung Tsang, Wing Keung Lam, Wai Kit Tam | 2016-09-20 |
| 9318457 | Methods of fabricating semiconductor chip solder structures | Roden R. Topacio | 2016-04-19 |
| 9142520 | Methods of fabricating semiconductor chip solder structures | Roden R. Topacio | 2015-09-22 |
| 8847383 | Integrated circuit package strip with stiffener | Vincent Chan, Roden R. Topacio | 2014-09-30 |
| 8785317 | Wafer level packaging of semiconductor chips | Adam Zbrzezny | 2014-07-22 |
| 8704353 | Thermal management of stacked semiconductor chips with electrically non-functional interconnects | Michael Z. Su, Bryan Black, Joe Siegel, Michael Alfano | 2014-04-22 |
| 8647974 | Method of fabricating a semiconductor chip with supportive terminal pad | Roden R. Topacio, Michael Z. Su | 2014-02-11 |
| 8633599 | Semiconductor chip with underfill anchors | Roden R. Topacio | 2014-01-21 |
| 8610262 | Ball grid array package with improved thermal characteristics | Ming Wang Sze, Kwok Cheung Tsang, Wing Keung Lam, Wai Kit Tam | 2013-12-17 |
| 8564122 | Circuit board component shim structure | Liane Martinez, Yip Seng Low, Suming Hu | 2013-10-22 |
| 8445329 | Circuit board with oval micro via | Andrew KW Leung | 2013-05-21 |
| 8389340 | Methods of forming semiconductor chip underfill anchors | Roden R. Topacio | 2013-03-05 |
| 8344505 | Wafer level packaging of semiconductor chips | Adam Zbrzezny | 2013-01-01 |
| 8330270 | Integrated circuit package having a plurality of spaced apart pad portions | Geraldine Tsui Yee Lin, Walter de Munnik, Kin Pui Kwan, Wing Him Lau, Kwok Cheung Tsang +1 more | 2012-12-11 |
| 8314474 | Under bump metallization for on-die capacitor | Fei Guo, Daniel A. Chung, Terence Cheung | 2012-11-20 |
| 8294266 | Conductor bump method and apparatus | Roden R. Topacio, Yip Seng Low, Andrew KW Leung | 2012-10-23 |
| 8120170 | Integrated package circuit with stiffener | Vincent Chan, Roden R. Topacio | 2012-02-21 |
| 8058108 | Methods of forming semiconductor chip underfill anchors | Roden R. Topacio | 2011-11-15 |
| 7994044 | Semiconductor chip with contoured solder structure opening | Roden R. Topacio | 2011-08-09 |
| 7985621 | Method and apparatus for making semiconductor packages | Vincent Chan, Roden R. Topacio | 2011-07-26 |
| 7969020 | Die stacking apparatus and method | Vincent Chan, Kevin O'Neil | 2011-06-28 |