| 12094853 |
Semiconductor chip with redundant thru-silicon-vias |
Michael Z. Su, Gamal Refai-Ahmed, Joe Siegel, Seth Prejean |
2024-09-17 |
$630,033,000 |
| 11602406 |
System and method for rapidly accessing an improved tourniquet |
— |
2023-03-14 |
|
| 11469212 |
Semiconductor chip with redundant thru-silicon-vias |
Michael Z. Su, Gamal Refai-Ahmed, Joe Siegel, Seth Prejean |
2022-10-11 |
$101,247,000 |
| 10842501 |
System and method for rapidly accessing an improved tourniquet |
— |
2020-11-24 |
|
| 10290606 |
Interposer with identification system |
Michael Alfano, Joe Siegel, Michael Z. Su, Julius Din |
2019-05-14 |
$20,760,000 |
| 9806014 |
Interposer with beyond reticle field conductor pads |
Michael Alfano, Michael Z. Su, Joseph Siegel, Julius Din, Anwar Kashem |
2017-10-31 |
$7,902,000 |
| 9793239 |
Semiconductor workpiece with selective backside metallization |
Michael Z. Su, Michael Alfano |
2017-10-17 |
$10,089,000 |
| 9627281 |
Semiconductor chip with thermal interface tape |
Seth Prejean, Dales Morrison Kent, Ronnie Brandon, Gamal Refai-Ahmed, Michael Z. Su +2 more |
2017-04-18 |
$12,891,000 |
| 9437561 |
Semiconductor chip with redundant thru-silicon-vias |
Michael Z. Su, Gamal Refai-Ahmed, Joe Siegel, Seth Prejean |
2016-09-06 |
$2,673,000 |
| 9385055 |
Stacked semiconductor chips with thermal management |
Gamal Refai-Ahmed, Michael Z. Su, Maxat Touzelbaev, Yizhang Yang |
2016-07-05 |
|
| 9263364 |
Thermal interface material with support structure |
Maxat Touzelbaev, Gamal Refai-Ahmed, Yizhang Yang |
2016-02-16 |
$417,000 |
| 8909840 |
Data bus inversion coding |
Aaron Nygren, Anwar Kashem, James M. O'Connor, Warren Fritz Kruger |
2014-12-09 |
$981,000 |
| 8866276 |
Semiconductor chip device with polymeric filler trench |
Michael Z. Su, Gamal Refai-Ahmed |
2014-10-21 |
$1,689,000 |
| 8796842 |
Stacked semiconductor chip device with thermal management circuit board |
Gamal Refai-Ahmed, Michael Z. Su |
2014-08-05 |
$3,132,000 |
| 8726139 |
Unified data masking, data poisoning, and data bus inversion signaling |
James M. O'Connor, Aaron Nygren, Anwar Kashem, Warren Fritz Kruger |
2014-05-13 |
$1,755,000 |
| 8704353 |
Thermal management of stacked semiconductor chips with electrically non-functional interconnects |
Michael Z. Su, Neil McLellan, Joe Siegel, Michael Alfano |
2014-04-22 |
$3,317,000 |
| 8691626 |
Semiconductor chip device with underfill |
Michael Z. Su, Lei Fu, Gamal Refai-Ahmed |
2014-04-08 |
$3,686,000 |
| 8617926 |
Semiconductor chip device with polymeric filler trench |
Michael Z. Su, Gamal Refai-Ahmed |
2013-12-31 |
$2,797,000 |
| 8574965 |
Semiconductor chip device with liquid thermal interface material |
Gamal Refai-Ahmed, Michael Z. Su |
2013-11-05 |
$2,151,000 |
| 8472190 |
Stacked semiconductor chip device with thermal management |
Gamal Refai-Ahmed, Michael Z. Su |
2013-06-25 |
$6,410,000 |
| 8451014 |
Die stacking, testing and packaging for yield |
Joseph Siegel |
2013-05-28 |
$3,942,000 |
| 8394672 |
Method of manufacturing and assembling semiconductor chips with offset pads |
Michael Z. Su, Gamal Refai-Ahmed |
2013-03-12 |
$5,623,000 |
| 8338961 |
Semiconductor chip with reinforcing through-silicon-vias |
Michael Z. Su, Gamal Refai-Ahmed |
2012-12-25 |
|
| 8193039 |
Semiconductor chip with reinforcing through-silicon-vias |
Michael Z. Su, Gamal Refai-Ahmed |
2012-06-05 |
$2,975,000 |
| 8034662 |
Thermal interface material with support structure |
Maxat Touzelbaev, Gamal Refai-Ahmed, Yizhang Yang |
2011-10-11 |
$4,727,000 |
