Issued Patents All Time
Showing 25 most recent of 26 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12094853 | Semiconductor chip with redundant thru-silicon-vias | Michael Z. Su, Gamal Refai-Ahmed, Joe Siegel, Seth Prejean | 2024-09-17 |
| 11602406 | System and method for rapidly accessing an improved tourniquet | — | 2023-03-14 |
| 11469212 | Semiconductor chip with redundant thru-silicon-vias | Michael Z. Su, Gamal Refai-Ahmed, Joe Siegel, Seth Prejean | 2022-10-11 |
| 10842501 | System and method for rapidly accessing an improved tourniquet | — | 2020-11-24 |
| 10290606 | Interposer with identification system | Michael Alfano, Joe Siegel, Michael Z. Su, Julius Din | 2019-05-14 |
| 9806014 | Interposer with beyond reticle field conductor pads | Michael Alfano, Michael Z. Su, Joseph Siegel, Julius Din, Anwar Kashem | 2017-10-31 |
| 9793239 | Semiconductor workpiece with selective backside metallization | Michael Z. Su, Michael Alfano | 2017-10-17 |
| 9627281 | Semiconductor chip with thermal interface tape | Seth Prejean, Dales Morrison Kent, Ronnie Brandon, Gamal Refai-Ahmed, Michael Z. Su +2 more | 2017-04-18 |
| 9437561 | Semiconductor chip with redundant thru-silicon-vias | Michael Z. Su, Gamal Refai-Ahmed, Joe Siegel, Seth Prejean | 2016-09-06 |
| 9385055 | Stacked semiconductor chips with thermal management | Gamal Refai-Ahmed, Michael Z. Su, Maxat Touzelbaev, Yizhang Yang | 2016-07-05 |
| 9263364 | Thermal interface material with support structure | Maxat Touzelbaev, Gamal Refai-Ahmed, Yizhang Yang | 2016-02-16 |
| 8909840 | Data bus inversion coding | Aaron Nygren, Anwar Kashem, James M. O'Connor, Warren Fritz Kruger | 2014-12-09 |
| 8866276 | Semiconductor chip device with polymeric filler trench | Michael Z. Su, Gamal Refai-Ahmed | 2014-10-21 |
| 8796842 | Stacked semiconductor chip device with thermal management circuit board | Gamal Refai-Ahmed, Michael Z. Su | 2014-08-05 |
| 8726139 | Unified data masking, data poisoning, and data bus inversion signaling | James M. O'Connor, Aaron Nygren, Anwar Kashem, Warren Fritz Kruger | 2014-05-13 |
| 8704353 | Thermal management of stacked semiconductor chips with electrically non-functional interconnects | Michael Z. Su, Neil McLellan, Joe Siegel, Michael Alfano | 2014-04-22 |
| 8691626 | Semiconductor chip device with underfill | Michael Z. Su, Lei Fu, Gamal Refai-Ahmed | 2014-04-08 |
| 8617926 | Semiconductor chip device with polymeric filler trench | Michael Z. Su, Gamal Refai-Ahmed | 2013-12-31 |
| 8574965 | Semiconductor chip device with liquid thermal interface material | Gamal Refai-Ahmed, Michael Z. Su | 2013-11-05 |
| 8472190 | Stacked semiconductor chip device with thermal management | Gamal Refai-Ahmed, Michael Z. Su | 2013-06-25 |
| 8451014 | Die stacking, testing and packaging for yield | Joseph Siegel | 2013-05-28 |
| 8394672 | Method of manufacturing and assembling semiconductor chips with offset pads | Michael Z. Su, Gamal Refai-Ahmed | 2013-03-12 |
| 8338961 | Semiconductor chip with reinforcing through-silicon-vias | Michael Z. Su, Gamal Refai-Ahmed | 2012-12-25 |
| 8193039 | Semiconductor chip with reinforcing through-silicon-vias | Michael Z. Su, Gamal Refai-Ahmed | 2012-06-05 |
| 8034662 | Thermal interface material with support structure | Maxat Touzelbaev, Gamal Refai-Ahmed, Yizhang Yang | 2011-10-11 |