| 9483092 |
Performance state boost for multi-core integrated circuit |
Samuel D. Naffziger, Baomin Liu |
2016-11-01 |
| 9385055 |
Stacked semiconductor chips with thermal management |
Gamal Refai-Ahmed, Michael Z. Su, Bryan Black, Yizhang Yang |
2016-07-05 |
| 9263944 |
Valley-fill power factor correction circuit with active conduction angle control |
— |
2016-02-16 |
| 9263364 |
Thermal interface material with support structure |
Gamal Refai-Ahmed, Yizhang Yang, Bryan Black |
2016-02-16 |
| 8868944 |
Computing center power and cooling control apparatus and method |
Gamal Refai-Ahmed, Stanley Ossias |
2014-10-21 |
| 8865527 |
Lid attach process |
Seah Sun Too, Janet Kirkland |
2014-10-21 |
| 8635044 |
Transient thermal modeling of multisource power devices |
Yizhang Yang, Gamal Refai-Ahmed |
2014-01-21 |
| 8497162 |
Lid attach process |
Seah Sun Too, Janet Kirkland |
2013-07-30 |
| 8304291 |
Semiconductor chip thermal interface structures |
Gamal Refai-Ahmed |
2012-11-06 |
| 8034662 |
Thermal interface material with support structure |
Gamal Refai-Ahmed, Yizhang Yang, Bryan Black |
2011-10-11 |
| 7999394 |
Void reduction in indium thermal interface material |
Seah Sun Too, Hsiang Wan Liau, Janet Kirkland, Tek Seng Tan, Raj N. Master |
2011-08-16 |
| 7911791 |
Heat sink for a circuit device |
Gamal Refai-Ahmed |
2011-03-22 |
| 7833839 |
Method for decreasing surface delamination of gel-type thermal interface material by management of the material cure temperature |
Raj N. Master, Frank Kuechenmeister |
2010-11-16 |
| 7678615 |
Semiconductor device with gel-type thermal interface material |
Raj N. Master, Frank Kuechenmeister |
2010-03-16 |
| 7651938 |
Void reduction in indium thermal interface material |
Seah Sun Too, Hsiang Wan Liau, Janet Kirkland, Tek Seng Tan, Raj N. Master |
2010-01-26 |
| 6984064 |
Thermal transfer measurement of an integrated circuit |
— |
2006-01-10 |
| 6794620 |
Feedforward temperature control of device under test |
— |
2004-09-21 |
| 6448992 |
Voltage programmable power dissipater |
— |
2002-09-10 |
