Issued Patents All Time
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9205486 | Metal alloy injection molding | Paul C. Bornemann, Raj N. Master, Michael J. Lane | 2015-12-08 |
| 9027631 | Metal alloy injection molding overflows | Paul C. Bornemann, Raj N. Master, Michael J. Lane | 2015-05-12 |
| 8991473 | Metal alloy injection molding protrusions | Paul C. Bornemann, Raj N. Master, Michael J. Lane | 2015-03-31 |
| 8865527 | Lid attach process | Maxat Touzelbaev, Janet Kirkland | 2014-10-21 |
| 8733423 | Metal alloy injection molding protrusions | Paul C. Bornemann, Raj N. Master, Michael J. Lane | 2014-05-27 |
| 8497162 | Lid attach process | Maxat Touzelbaev, Janet Kirkland | 2013-07-30 |
| 8378458 | Semiconductor chip with a rounded corner | Edward S. Alcid | 2013-02-19 |
| 8297986 | Integrated circuit socket | Raj N. Master, Jacquana Diep, Mohammad Khan | 2012-10-30 |
| 8232138 | Circuit board with notched stiffener frame | Kevin Lim, Mohammad Khan | 2012-07-31 |
| 8017434 | Semiconductor chip package fixture | Kevin Lim, Azlina N. Nayan, Kee Hean Keok, Soon Tatt Ow Yong | 2011-09-13 |
| 7999394 | Void reduction in indium thermal interface material | Hsiang Wan Liau, Janet Kirkland, Tek Seng Tan, Maxat Touzelbaev, Raj N. Master | 2011-08-16 |
| 7860599 | Lid attachment mechanism | — | 2010-12-28 |
| 7651938 | Void reduction in indium thermal interface material | Hsiang Wan Liau, Janet Kirkland, Tek Seng Tan, Maxat Touzelbaev, Raj N. Master | 2010-01-26 |
| 7633151 | Integrated circuit package lid with a wetting film | Jacquana Diep, Mohammad Khan | 2009-12-15 |
| 7544542 | Reduction of damage to thermal interface material due to asymmetrical load | Raj N. Master, Jacquana Diep, Mohammad Khan | 2009-06-09 |
| 7513035 | Method of integrated circuit packaging | Mohammad Khan, James Hayward, Jacquana Diep | 2009-04-07 |
| 7256065 | Methods and fixture for coupling a lid to a support substrate | Edward S. Alcid, Ahmad Juwanda, Keng Sang Cha, Leang Hua Kam, Tek Seng Tan | 2007-08-14 |
| 7256067 | LGA fixture for indium assembly process | Tek Seng Tan, Keng Sang Cha, Kee Hean Keok | 2007-08-14 |
| 6936501 | Semiconductor component and method of manufacture | James Hayward, Janet Kirkland | 2005-08-30 |
| 6870258 | Fixture suitable for use in coupling a lid to a substrate and method | — | 2005-03-22 |