| 9205486 |
Metal alloy injection molding |
Paul C. Bornemann, Raj N. Master, Michael J. Lane |
2015-12-08 |
$46,233,000 |
| 9027631 |
Metal alloy injection molding overflows |
Paul C. Bornemann, Raj N. Master, Michael J. Lane |
2015-05-12 |
$40,939,000 |
| 8991473 |
Metal alloy injection molding protrusions |
Paul C. Bornemann, Raj N. Master, Michael J. Lane |
2015-03-31 |
|
| 8865527 |
Lid attach process |
Maxat Touzelbaev, Janet Kirkland |
2014-10-21 |
$1,689,000 |
| 8733423 |
Metal alloy injection molding protrusions |
Paul C. Bornemann, Raj N. Master, Michael J. Lane |
2014-05-27 |
$33,362,000 |
| 8497162 |
Lid attach process |
Maxat Touzelbaev, Janet Kirkland |
2013-07-30 |
$3,697,000 |
| 8378458 |
Semiconductor chip with a rounded corner |
Edward S. Alcid |
2013-02-19 |
$2,503,000 |
| 8297986 |
Integrated circuit socket |
Raj N. Master, Jacquana Diep, Mohammad Khan |
2012-10-30 |
|
| 8232138 |
Circuit board with notched stiffener frame |
Kevin Lim, Mohammad Khan |
2012-07-31 |
$3,897,000 |
| 8017434 |
Semiconductor chip package fixture |
Kevin Lim, Azlina N. Nayan, Kee Hean Keok, Soon Tatt Ow Yong |
2011-09-13 |
$4,525,000 |
| 7999394 |
Void reduction in indium thermal interface material |
Hsiang Wan Liau, Janet Kirkland, Tek Seng Tan, Maxat Touzelbaev, Raj N. Master |
2011-08-16 |
$3,370,000 |
| 7860599 |
Lid attachment mechanism |
— |
2010-12-28 |
$4,143,000 |
| 7651938 |
Void reduction in indium thermal interface material |
Hsiang Wan Liau, Janet Kirkland, Tek Seng Tan, Maxat Touzelbaev, Raj N. Master |
2010-01-26 |
$13,320,000 |
| 7633151 |
Integrated circuit package lid with a wetting film |
Jacquana Diep, Mohammad Khan |
2009-12-15 |
$19,433,000 |
| 7544542 |
Reduction of damage to thermal interface material due to asymmetrical load |
Raj N. Master, Jacquana Diep, Mohammad Khan |
2009-06-09 |
$8,157,000 |
| 7513035 |
Method of integrated circuit packaging |
Mohammad Khan, James Hayward, Jacquana Diep |
2009-04-07 |
$10,823,000 |
| 7256065 |
Methods and fixture for coupling a lid to a support substrate |
Edward S. Alcid, Ahmad Juwanda, Keng Sang Cha, Leang Hua Kam, Tek Seng Tan |
2007-08-14 |
$3,919,000 |
| 7256067 |
LGA fixture for indium assembly process |
Tek Seng Tan, Keng Sang Cha, Kee Hean Keok |
2007-08-14 |
$3,919,000 |
| 6936501 |
Semiconductor component and method of manufacture |
James Hayward, Janet Kirkland |
2005-08-30 |
$5,346,000 |
| 6870258 |
Fixture suitable for use in coupling a lid to a substrate and method |
— |
2005-03-22 |
$6,839,000 |
