| 9661770 |
Graphic formation via material ablation |
Mark Thomas McCormack, Michael J. Lane, Krishna Darbha, Ralf Groene, James Alec Ishihara +1 more |
2017-05-23 |
$34,380,000 |
| 9563233 |
Electronic device with plated electrical contact |
Mark Thomas McCormack, Anthony Allen Fischer, Farah Shariff, Dennis Tom, Zulfiqar Alam |
2017-02-07 |
$50,314,000 |
| 9205486 |
Metal alloy injection molding |
Paul C. Bornemann, Michael J. Lane, Seah Sun Too |
2015-12-08 |
$46,233,000 |
| 9027631 |
Metal alloy injection molding overflows |
Paul C. Bornemann, Michael J. Lane, Seah Sun Too |
2015-05-12 |
$40,939,000 |
| 8991473 |
Metal alloy injection molding protrusions |
Paul C. Bornemann, Michael J. Lane, Seah Sun Too |
2015-03-31 |
|
| 8733423 |
Metal alloy injection molding protrusions |
Paul C. Bornemann, Michael J. Lane, Seah Sun Too |
2014-05-27 |
$33,362,000 |
| 8297986 |
Integrated circuit socket |
Seah Sun Too, Jacquana Diep, Mohammad Khan |
2012-10-30 |
|
| 7999394 |
Void reduction in indium thermal interface material |
Seah Sun Too, Hsiang Wan Liau, Janet Kirkland, Tek Seng Tan, Maxat Touzelbaev |
2011-08-16 |
$3,370,000 |
| 7923850 |
Semiconductor chip with solder joint protection ring |
Mohammad Khan, Jun Zhai, Ranjit Gannamani |
2011-04-12 |
$5,867,000 |
| 7833839 |
Method for decreasing surface delamination of gel-type thermal interface material by management of the material cure temperature |
Maxat Touzelbaev, Frank Kuechenmeister |
2010-11-16 |
$9,175,000 |
| 7678615 |
Semiconductor device with gel-type thermal interface material |
Maxat Touzelbaev, Frank Kuechenmeister |
2010-03-16 |
$8,771,000 |
| 7651938 |
Void reduction in indium thermal interface material |
Seah Sun Too, Hsiang Wan Liau, Janet Kirkland, Tek Seng Tan, Maxat Touzelbaev |
2010-01-26 |
$13,320,000 |
| 7601612 |
Method for forming solder joints for a flip chip assembly |
Junaida A. Bakar, Diong Hing Ding, Srinivasan Parthasarathy |
2009-10-13 |
$8,603,000 |
| 7544542 |
Reduction of damage to thermal interface material due to asymmetrical load |
Seah Sun Too, Jacquana Diep, Mohammad Khan |
2009-06-09 |
$8,157,000 |
| 7215030 |
Lead-free semiconductor package |
Srinivasan Anand, Srinivasan Parthasarathy, Yew Cheong Mui |
2007-05-08 |
$28,263,000 |
| 6812570 |
Organic packages having low tin solder connections |
Mohammad Khan, Maria Guardado, Charles Anderson |
2004-11-02 |
$2,431,000 |
| 6722553 |
Controlled and programmed deposition of flux on a flip-chip die by spraying |
Mohammad Khan, Maria Guardado, Ooi T. Ong |
2004-04-20 |
$2,632,000 |
| 6709963 |
Method and apparatus for jet printing a flux pattern selectively on flip-chip bumps |
Jonathan D. Halderman |
2004-03-23 |
$3,151,000 |
| 6657707 |
Metallurgical inspection and/or analysis of flip-chip pads and interfaces |
David Bruce Morken |
2003-12-02 |
$4,088,000 |
| 6632690 |
Method of fabricating reliable laminate flip-chip assembly |
Edward S. Alcid, Diong Hing Ding |
2003-10-14 |
$7,133,000 |
| 6617195 |
Method of reflowing organic packages using no-clean flux |
Mohammad Khan, Maria Guardado |
2003-09-09 |
$4,832,000 |
| 6591992 |
Boat for cleaning ball grid array packages |
Ajit M. Dubey, Ong Ot, Chan Cs |
2003-07-15 |
$1,952,000 |
| 6536649 |
Method of preventing residue contamination of semiconductor devices during furnace processing |
Jonathan D. Halderman |
2003-03-25 |
$2,887,000 |
| 6488158 |
Boat for organic and ceramic flip chip package assembly |
Mohammad Khan, Maria Guardado, Loo L. Teoh, Ahmad Juwanda |
2002-12-03 |
$4,258,000 |
| 6446818 |
Boat for cleaning ball grid array packages |
Ajit M. Dubey, Ot Ong, C S Chan |
2002-09-10 |
$1,244,000 |
