Issued Patents All Time
Showing 25 most recent of 52 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9661770 | Graphic formation via material ablation | Mark Thomas McCormack, Michael J. Lane, Krishna Darbha, Ralf Groene, James Alec Ishihara +1 more | 2017-05-23 |
| 9563233 | Electronic device with plated electrical contact | Mark Thomas McCormack, Anthony Allen Fischer, Farah Shariff, Dennis Tom, Zulfiqar Alam | 2017-02-07 |
| 9205486 | Metal alloy injection molding | Paul C. Bornemann, Michael J. Lane, Seah Sun Too | 2015-12-08 |
| 9027631 | Metal alloy injection molding overflows | Paul C. Bornemann, Michael J. Lane, Seah Sun Too | 2015-05-12 |
| 8991473 | Metal alloy injection molding protrusions | Paul C. Bornemann, Michael J. Lane, Seah Sun Too | 2015-03-31 |
| 8733423 | Metal alloy injection molding protrusions | Paul C. Bornemann, Michael J. Lane, Seah Sun Too | 2014-05-27 |
| 8297986 | Integrated circuit socket | Seah Sun Too, Jacquana Diep, Mohammad Khan | 2012-10-30 |
| 7999394 | Void reduction in indium thermal interface material | Seah Sun Too, Hsiang Wan Liau, Janet Kirkland, Tek Seng Tan, Maxat Touzelbaev | 2011-08-16 |
| 7923850 | Semiconductor chip with solder joint protection ring | Mohammad Khan, Jun Zhai, Ranjit Gannamani | 2011-04-12 |
| 7833839 | Method for decreasing surface delamination of gel-type thermal interface material by management of the material cure temperature | Maxat Touzelbaev, Frank Kuechenmeister | 2010-11-16 |
| 7678615 | Semiconductor device with gel-type thermal interface material | Maxat Touzelbaev, Frank Kuechenmeister | 2010-03-16 |
| 7651938 | Void reduction in indium thermal interface material | Seah Sun Too, Hsiang Wan Liau, Janet Kirkland, Tek Seng Tan, Maxat Touzelbaev | 2010-01-26 |
| 7601612 | Method for forming solder joints for a flip chip assembly | Junaida A. Bakar, Diong Hing Ding, Srinivasan Parthasarathy | 2009-10-13 |
| 7544542 | Reduction of damage to thermal interface material due to asymmetrical load | Seah Sun Too, Jacquana Diep, Mohammad Khan | 2009-06-09 |
| 7215030 | Lead-free semiconductor package | Srinivasan Anand, Srinivasan Parthasarathy, Yew Cheong Mui | 2007-05-08 |
| 6812570 | Organic packages having low tin solder connections | Mohammad Khan, Maria Guardado, Charles Anderson | 2004-11-02 |
| 6722553 | Controlled and programmed deposition of flux on a flip-chip die by spraying | Mohammad Khan, Maria Guardado, Ooi T. Ong | 2004-04-20 |
| 6709963 | Method and apparatus for jet printing a flux pattern selectively on flip-chip bumps | Jonathan D. Halderman | 2004-03-23 |
| 6657707 | Metallurgical inspection and/or analysis of flip-chip pads and interfaces | David Bruce Morken | 2003-12-02 |
| 6632690 | Method of fabricating reliable laminate flip-chip assembly | Edward S. Alcid, Diong Hing Ding | 2003-10-14 |
| 6617195 | Method of reflowing organic packages using no-clean flux | Mohammad Khan, Maria Guardado | 2003-09-09 |
| 6591992 | Boat for cleaning ball grid array packages | Ajit M. Dubey, Ong Ot, Chan Cs | 2003-07-15 |
| 6536649 | Method of preventing residue contamination of semiconductor devices during furnace processing | Jonathan D. Halderman | 2003-03-25 |
| 6488158 | Boat for organic and ceramic flip chip package assembly | Mohammad Khan, Maria Guardado, Loo L. Teoh, Ahmad Juwanda | 2002-12-03 |
| 6446818 | Boat for cleaning ball grid array packages | Ajit M. Dubey, Ot Ong, C S Chan | 2002-09-10 |