Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9495491 | Reliability aware thermal design | Kingsuk Maitra, Tung Thanh Nguyen, Brian K. Langendorf, Julia Purtell, Rune Hartung Jensen +1 more | 2016-11-15 |
| 8174131 | Semiconductor device having a filled trench structure and methods for fabricating the same | Zhen Zhang, Frank Kuechenmeister, Jaime Bravo, Michael Z. Su, Kevin Lim | 2012-05-08 |
| 7923850 | Semiconductor chip with solder joint protection ring | Mohammad Khan, Jun Zhai, Raj N. Master | 2011-04-12 |
| 7745264 | Semiconductor chip with stratified underfill | Jun Zhai, Srinivasan Parthasarathy | 2010-06-29 |
| 6241907 | Method and system for providing a package for decapsulating a chip-scale package | Xia Li | 2001-06-05 |