Issued Patents All Time
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8297986 | Integrated circuit socket | Seah Sun Too, Raj N. Master, Jacquana Diep | 2012-10-30 |
| 8232138 | Circuit board with notched stiffener frame | Kevin Lim, Seah Sun Too | 2012-07-31 |
| 7923850 | Semiconductor chip with solder joint protection ring | Jun Zhai, Ranjit Gannamani, Raj N. Master | 2011-04-12 |
| 7633151 | Integrated circuit package lid with a wetting film | Seah Sun Too, Jacquana Diep | 2009-12-15 |
| 7544542 | Reduction of damage to thermal interface material due to asymmetrical load | Seah Sun Too, Raj N. Master, Jacquana Diep | 2009-06-09 |
| 7513035 | Method of integrated circuit packaging | Seah Sun Too, James Hayward, Jacquana Diep | 2009-04-07 |
| 6857790 | Apparatus and method to vertically route and connect multiple optical fibers | Edwin Fontecha | 2005-02-22 |
| 6812570 | Organic packages having low tin solder connections | Raj N. Master, Maria Guardado, Charles Anderson | 2004-11-02 |
| 6722553 | Controlled and programmed deposition of flux on a flip-chip die by spraying | Raj N. Master, Maria Guardado, Ooi T. Ong | 2004-04-20 |
| 6671450 | Apparatus and method to metallize, reinforce, and hermetically seal multiple optical fibers | Maria Guardado, Rickquel B. Garcia | 2003-12-30 |
| 6617195 | Method of reflowing organic packages using no-clean flux | Raj N. Master, Maria Guardado | 2003-09-09 |
| 6488158 | Boat for organic and ceramic flip chip package assembly | Raj N. Master, Maria Guardado, Loo L. Teoh, Ahmad Juwanda | 2002-12-03 |
| 6417563 | Spring frame for protecting packaged electronic devices | Jonathan D. Halderman, Alexander C. Tain, Tom Ley | 2002-07-09 |
| 6409070 | Minimizing flux residue by controlling amount of moisture during reflow | Raj N. Master, Maria Guardado, Diong Hing Ding, Junaida A. Bakar | 2002-06-25 |
| 6382500 | Solder reflow furnace with flux effluent collector and method of preventing flux contamination | Raj N. Master, Maria Guardado, Sp Lee, Sofi Mohd | 2002-05-07 |
| 6371310 | Boat for land grid array packages | Raj N. Master, L. K. Teoh | 2002-04-16 |
| 6208027 | Temporary interconnect for semiconductor devices | Jerrold L. King | 2001-03-27 |
| 6103549 | No clean flux for flip chip assembly | Raj N. Master, Orion K. Starr, Maria Guardado | 2000-08-15 |
| 6098867 | Automated brush fluxing system for application of controlled amount of flux to packages | Raj N. Master, Maria Guardado | 2000-08-08 |
| 5988485 | Flux cleaning for flip chip technology using environmentally friendly solvents | Raj N. Master, Orion K. Starr | 1999-11-23 |
| 5572692 | Memory configuration decoding system having automatic row base address generation mechanism for variable memory devices with row access interleaving | Robert N. Murdoch | 1996-11-05 |