Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7601612 | Method for forming solder joints for a flip chip assembly | Raj N. Master, Diong Hing Ding, Srinivasan Parthasarathy | 2009-10-13 |
| 6409070 | Minimizing flux residue by controlling amount of moisture during reflow | Raj N. Master, Mohammad Khan, Maria Guardado, Diong Hing Ding | 2002-06-25 |