Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 7601612 | Method for forming solder joints for a flip chip assembly | Raj N. Master, Diong Hing Ding, Srinivasan Parthasarathy | 2009-10-13 | $8,603,000 |
| 6409070 | Minimizing flux residue by controlling amount of moisture during reflow | Raj N. Master, Mohammad Khan, Maria Guardado, Diong Hing Ding | 2002-06-25 | $2,000,000 |