| 6812570 |
Organic packages having low tin solder connections |
Raj N. Master, Mohammad Khan, Charles Anderson |
2004-11-02 |
| 6722553 |
Controlled and programmed deposition of flux on a flip-chip die by spraying |
Raj N. Master, Mohammad Khan, Ooi T. Ong |
2004-04-20 |
| 6671450 |
Apparatus and method to metallize, reinforce, and hermetically seal multiple optical fibers |
Mohammad Khan, Rickquel B. Garcia |
2003-12-30 |
| 6617195 |
Method of reflowing organic packages using no-clean flux |
Raj N. Master, Mohammad Khan |
2003-09-09 |
| 6603916 |
Lightwave circuit assembly having low deformation balanced sandwich substrate |
Kenneth McGreer, Peter D. Ascanio, Randal E. Zugnoni |
2003-08-05 |
| 6488158 |
Boat for organic and ceramic flip chip package assembly |
Mohammad Khan, Raj N. Master, Loo L. Teoh, Ahmad Juwanda |
2002-12-03 |
| 6468917 |
Method for modifying a C4 semiconductor device |
Susan Xia Li, Arnold Louie |
2002-10-22 |
| 6409070 |
Minimizing flux residue by controlling amount of moisture during reflow |
Raj N. Master, Mohammad Khan, Diong Hing Ding, Junaida A. Bakar |
2002-06-25 |
| 6382500 |
Solder reflow furnace with flux effluent collector and method of preventing flux contamination |
Raj N. Master, Mohammad Khan, Sp Lee, Sofi Mohd |
2002-05-07 |
| 6103549 |
No clean flux for flip chip assembly |
Raj N. Master, Orion K. Starr, Mohammad Khan |
2000-08-15 |
| 6098867 |
Automated brush fluxing system for application of controlled amount of flux to packages |
Raj N. Master, Mohammad Khan |
2000-08-08 |