Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6812570 | Organic packages having low tin solder connections | Raj N. Master, Mohammad Khan, Charles Anderson | 2004-11-02 |
| 6722553 | Controlled and programmed deposition of flux on a flip-chip die by spraying | Raj N. Master, Mohammad Khan, Ooi T. Ong | 2004-04-20 |
| 6671450 | Apparatus and method to metallize, reinforce, and hermetically seal multiple optical fibers | Mohammad Khan, Rickquel B. Garcia | 2003-12-30 |
| 6617195 | Method of reflowing organic packages using no-clean flux | Raj N. Master, Mohammad Khan | 2003-09-09 |
| 6603916 | Lightwave circuit assembly having low deformation balanced sandwich substrate | Kenneth McGreer, Peter D. Ascanio, Randal E. Zugnoni | 2003-08-05 |
| 6488158 | Boat for organic and ceramic flip chip package assembly | Mohammad Khan, Raj N. Master, Loo L. Teoh, Ahmad Juwanda | 2002-12-03 |
| 6468917 | Method for modifying a C4 semiconductor device | Susan Xia Li, Arnold Louie | 2002-10-22 |
| 6409070 | Minimizing flux residue by controlling amount of moisture during reflow | Raj N. Master, Mohammad Khan, Diong Hing Ding, Junaida A. Bakar | 2002-06-25 |
| 6382500 | Solder reflow furnace with flux effluent collector and method of preventing flux contamination | Raj N. Master, Mohammad Khan, Sp Lee, Sofi Mohd | 2002-05-07 |
| 6103549 | No clean flux for flip chip assembly | Raj N. Master, Orion K. Starr, Mohammad Khan | 2000-08-15 |
| 6098867 | Automated brush fluxing system for application of controlled amount of flux to packages | Raj N. Master, Mohammad Khan | 2000-08-08 |