Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11450732 | Structure for capacitor protection, package structure, and method of forming package structure | Zhe Liu, Borrong Huang, Hongjie Wang | 2022-09-20 | |
| 7601612 | Method for forming solder joints for a flip chip assembly | Raj N. Master, Junaida A. Bakar, Srinivasan Parthasarathy | 2009-10-13 | $8,603,000 |
| 6632690 | Method of fabricating reliable laminate flip-chip assembly | Raj N. Master, Edward S. Alcid | 2003-10-14 | $7,133,000 |
| 6409070 | Minimizing flux residue by controlling amount of moisture during reflow | Raj N. Master, Mohammad Khan, Maria Guardado, Junaida A. Bakar | 2002-06-25 | $2,000,000 |