Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8723314 | Semiconductor workpiece with backside metallization and methods of dicing the same | Michael Z. Su, Lei Fu | 2014-05-13 |
| 8378458 | Semiconductor chip with a rounded corner | Seah Sun Too | 2013-02-19 |
| 7256065 | Methods and fixture for coupling a lid to a support substrate | Seah Sun Too, Ahmad Juwanda, Keng Sang Cha, Leang Hua Kam, Tek Seng Tan | 2007-08-14 |
| 6632690 | Method of fabricating reliable laminate flip-chip assembly | Raj N. Master, Diong Hing Ding | 2003-10-14 |
| 6538320 | Heat spreader having holes for rivet-like adhesive connections | Eric Tosaya | 2003-03-25 |
| 6483169 | Extruded heat spreader | Eric Tosaya | 2002-11-19 |
| 6442234 | X-ray inspection of ball contacts and internal vias | David Bruce Morken | 2002-08-27 |