Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 7999394 | Void reduction in indium thermal interface material | Seah Sun Too, Hsiang Wan Liau, Janet Kirkland, Maxat Touzelbaev, Raj N. Master | 2011-08-16 | $3,370,000 |
| 7651938 | Void reduction in indium thermal interface material | Seah Sun Too, Hsiang Wan Liau, Janet Kirkland, Maxat Touzelbaev, Raj N. Master | 2010-01-26 | $13,320,000 |
| 7622311 | Inspection of underfill in integrated circuit package | Keng Sang Cha, Haris Fazelah, Ahmad Zahrain B. Mohamad Shakir | 2009-11-24 | $15,588,000 |
| 7256065 | Methods and fixture for coupling a lid to a support substrate | Seah Sun Too, Edward S. Alcid, Ahmad Juwanda, Keng Sang Cha, Leang Hua Kam | 2007-08-14 | $3,919,000 |
| 7256067 | LGA fixture for indium assembly process | Seah Sun Too, Keng Sang Cha, Kee Hean Keok | 2007-08-14 | $3,919,000 |