Void reduction in indium thermal interface material

Assignee

• AMD

Inventors

• Seah Sun Too (20 patents)
• Hsiang Wan Liau (3 patents)
• Janet Kirkland (7 patents)
• Tek Seng Tan (5 patents)
• Maxat Touzelbaev (18 patents)
• Raj N. Master (52 patents)

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