| 12334455 |
Semiconductor package with integrated capacitors |
Michael Alfano, Siddharth Ravichandran |
2025-06-17 |
|
| 12288756 |
Semiconductor package with integrated capacitors |
Michael Alfano, Siddharth Ravichandran |
2025-04-29 |
|
| 12094853 |
Semiconductor chip with redundant thru-silicon-vias |
Bryan Black, Gamal Refai-Ahmed, Joe Siegel, Seth Prejean |
2024-09-17 |
$630,033,000 |
| 11469212 |
Semiconductor chip with redundant thru-silicon-vias |
Bryan Black, Gamal Refai-Ahmed, Joe Siegel, Seth Prejean |
2022-10-11 |
$101,247,000 |
| 10290606 |
Interposer with identification system |
Michael Alfano, Joe Siegel, Bryan Black, Julius Din |
2019-05-14 |
$20,760,000 |
| 9806014 |
Interposer with beyond reticle field conductor pads |
Michael Alfano, Bryan Black, Joseph Siegel, Julius Din, Anwar Kashem |
2017-10-31 |
$7,902,000 |
| 9793239 |
Semiconductor workpiece with selective backside metallization |
Michael Alfano, Bryan Black |
2017-10-17 |
$10,089,000 |
| 9627281 |
Semiconductor chip with thermal interface tape |
Seth Prejean, Dales Morrison Kent, Ronnie Brandon, Gamal Refai-Ahmed, Michael D. Bienek +2 more |
2017-04-18 |
$12,891,000 |
| 9449907 |
Stacked semiconductor chips packaging |
Lei Fu, Frank Kuechenmeister |
2016-09-20 |
$5,529,000 |
| 9437561 |
Semiconductor chip with redundant thru-silicon-vias |
Bryan Black, Gamal Refai-Ahmed, Joe Siegel, Seth Prejean |
2016-09-06 |
$2,673,000 |
| 9385055 |
Stacked semiconductor chips with thermal management |
Gamal Refai-Ahmed, Bryan Black, Maxat Touzelbaev, Yizhang Yang |
2016-07-05 |
|
| 8866276 |
Semiconductor chip device with polymeric filler trench |
Gamal Refai-Ahmed, Bryan Black |
2014-10-21 |
$1,689,000 |
| 8796842 |
Stacked semiconductor chip device with thermal management circuit board |
Gamal Refai-Ahmed, Bryan Black |
2014-08-05 |
$3,132,000 |
| 8759962 |
Semiconductor chip device with solder diffusion protection |
— |
2014-06-24 |
$2,752,000 |
| 8749254 |
Power cycling test arrangement |
— |
2014-06-10 |
$3,265,000 |
| 8723314 |
Semiconductor workpiece with backside metallization and methods of dicing the same |
Lei Fu, Edward S. Alcid |
2014-05-13 |
$1,755,000 |
| 8704353 |
Thermal management of stacked semiconductor chips with electrically non-functional interconnects |
Bryan Black, Neil McLellan, Joe Siegel, Michael Alfano |
2014-04-22 |
$3,317,000 |
| 8691626 |
Semiconductor chip device with underfill |
Lei Fu, Gamal Refai-Ahmed, Bryan Black |
2014-04-08 |
$3,686,000 |
| 8647974 |
Method of fabricating a semiconductor chip with supportive terminal pad |
Roden R. Topacio, Neil McLellan |
2014-02-11 |
$6,027,000 |
| 8624404 |
Integrated circuit package having offset vias |
Lei Fu, Frank Kuechenmeister |
2014-01-07 |
$3,415,000 |
| 8617926 |
Semiconductor chip device with polymeric filler trench |
Gamal Refai-Ahmed, Bryan Black |
2013-12-31 |
$2,797,000 |
| 8574965 |
Semiconductor chip device with liquid thermal interface material |
Gamal Refai-Ahmed, Bryan Black |
2013-11-05 |
$2,151,000 |
| 8472190 |
Stacked semiconductor chip device with thermal management |
Gamal Refai-Ahmed, Bryan Black |
2013-06-25 |
$6,410,000 |
| 8394672 |
Method of manufacturing and assembling semiconductor chips with offset pads |
Gamal Refai-Ahmed, Bryan Black |
2013-03-12 |
$5,623,000 |
| 8338961 |
Semiconductor chip with reinforcing through-silicon-vias |
Gamal Refai-Ahmed, Bryan Black |
2012-12-25 |
|
