Issued Patents All Time
Showing 26–37 of 37 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8299633 | Semiconductor chip device with solder diffusion protection | — | 2012-10-30 |
| 8293581 | Semiconductor chip with protective scribe structure | Lei Fu | 2012-10-23 |
| 8293636 | Conductive connection structure with stress reduction arrangement for a semiconductor device, and related fabrication method | Thomas Schulze, Frank Kuechenmeister, Lei Fu | 2012-10-23 |
| 8193039 | Semiconductor chip with reinforcing through-silicon-vias | Gamal Refai-Ahmed, Bryan Black | 2012-06-05 |
| 8174131 | Semiconductor device having a filled trench structure and methods for fabricating the same | Zhen Zhang, Frank Kuechenmeister, Jaime Bravo, Ranjit Gannamani, Kevin Lim | 2012-05-08 |
| 7977160 | Semiconductor devices having stress relief layers and methods for fabricating the same | Frank G. Küchenmeister, Lei Fu | 2011-07-12 |
| 7897433 | Semiconductor chip with reinforcement layer and method of making the same | Frank Kuechenmeister, Jaime Bravo | 2011-03-01 |
| 7737563 | Semiconductor chip with reinforcement structure | Lei Fu | 2010-06-15 |
| 7679200 | Semiconductor chip with crack stop | Jaime Bravo, Lei Fu, Jun Zhai | 2010-03-16 |
| 7259458 | Integrated circuit with increased heat transfer | David H. Eppes | 2007-08-21 |
| 7206703 | System and method for testing packaged devices using time domain reflectometry | Vassilios Papageorgiou, Amado Ramirez, Gary Alexander Cousins | 2007-04-17 |
| 7197727 | Interconnect speed sensing circuitry | — | 2007-03-27 |